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Nobuyuki Shishido · SciRah

Researcher profile · Semantic Scholar

Nobuyuki Shishido

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Nobuyuki Shishido — researcher profile on SciRah

h-index: 8
Works: 99
Citations: 167

Most-cited papers

Application of Nonlinear Fracture Mechanics Parameter to Predicting Wire-Liftoff Lifetime of Power Module at Elevated Temperatures
Nobuyuki Shishido, Yutaka Hayama, Wataru Morooka, S. Hagihara +1 more
2019IEEE Journal of Emerging and Selected Topics in Power Electronics16 citations
Semantic Scholar
Grain-scale adhesion strength mapping of copper wiring structures in integrated circuits
S. Kamiya, Nobuyuki Shishido, S. Watanabe, Hisashi Sato +7 more
201316 citations
Semantic Scholar
Review of Methodologies for Structural Integrity Evaluation of Power Modules
N. Miyazaki, Nobuyuki Shishido, Yutaka Hayama
202114 citations Open access
Semantic Scholar
Characterization of plastic and creep behavior in thick aluminum wire for power modules
Nobuyuki Shishido, Y. Setoguchi, Y. Kumagai, M. Koganemaru +3 more
2021Microelectronics and reliability12 citations Open access
Semantic Scholar
Non-linear analyses of strain in flip chip packages improved by the measurement using the digital image correlation method
T. Ikeda, Toshifumi Kanno, Nobuyuki Shishido, N. Miyazaki +2 more
2013Microelectronics and reliability12 citations Open access
Semantic Scholar
Methodology for calculating J-integral range ΔJ under cyclic loading
S. Hagihara, Nobuyuki Shishido, Yutaka Hayama, N. Miyazaki
202111 citations
Semantic Scholar
High‐Strength Sub‐Micrometer Spherical Particles Fabricated by Pulsed Laser Melting in Liquid
Mitsuhiko Kondo, Nobuyuki Shishido, S. Kamiya, A. Kubo +3 more
2018Particle & particle systems characterization11 citations
Semantic Scholar
Thermal Strain Measurement on Electronic Packages Using Digital Image Correlation Method
Nobuyuki Shishido, T. Ikeda, N. Miyazaki, Kentaro Nakamura +2 more
20088 citations Open access
Semantic Scholar
Experimental and numerical evaluation of interfacial adhesion on Cu/SiN in LSI interconnect structures
M. Omiya, K. Koiwa, Nobuyuki Shishido, S. Kamiya +7 more
2013Microelectronics and reliability7 citations
Semantic Scholar
Strain measurement in the microstructure of advanced electronic packages using digital image correlation
Nobuyuki Shishido, T. Ikeda, N. Miyazaki, Y. Honmachi
20052005 International Symposium on Electronics Materials and Packaging5 citations
Semantic Scholar
Fracture and Embedment Behavior of Brittle Submicrometer Spherical Particles Fabricated by Pulsed Laser Melting in Liquid Using a Scanning Electron Microscope Nanoindenter
D. Nakamura, N. Koshizaki, Nobuyuki Shishido, S. Kamiya +1 more
2021Nanomaterials4 citations Open access
Semantic Scholar
Micro-scale evaluation of interface strength on the patterned structures in LSI interconnects
S. Kamiya, Hisashi Sato, M. Nishida, Chuan-Tong Chen +6 more
20104 citations
Semantic Scholar
Strain Measurement in a Microstructure Using Digital Image Correlation for a Laser-Scanning Microscopic Image
Nobuyuki Shishido, T. Ikeda, N. Miyazaki
20084 citations
Semantic Scholar
A multidimensional scheme of characterization for performance deterioration behavior of flexible devices under bending deformation
S. Kamiya, H. Izumi, Tomohito Sekine, Nobuyuki Shishido +5 more
20203 citations
Semantic Scholar
Investigation of continuous deformation behavior around initial yield point of single crystal copper by using micro scale torsion test
K. Koiwa, Nobuyuki Shishido, Chuan-Tong Chen, M. Omiya +7 more
20163 citations
Semantic Scholar
Specimen size effect on elastic–plastic strength evaluation of interface between thin films
Chuan-Tong Chen, K. Koiwa, Nobuyuki Shishido, S. Kamiya +7 more
20143 citations
Semantic Scholar
Crystal orientation effect on local adhesion strength of the interface between a damascene copper line and the insulation layer
Nobuyuki Shishido, Y. Oura, Hisashi Sato, S. Kamiya +7 more
20143 citations
Semantic Scholar
Evaluation for interface strength fluctuations induced by inhomogeneous grain structure of Cu line in LSI Interconnects
Chuan-Tong Chen, Nobuyuki Shishido, S. Kamiya, K. Koiwa +7 more
20143 citations
Semantic Scholar
Development of Cu/Insulation Layer Interface Crack Extension Simulation with Crystal Plasticity
K. Koiwa, M. Omiya, Nobuyuki Shishido, S. Kamiya +6 more
20133 citations
Semantic Scholar
Effect of Bond Thickness on the Fracture Toughness and the Strain Field around a Crack Tip in Adhesive Joints Using Epoxy Resin Modified with Solid Rubber Particles
M. Ueda, Nobuyuki Shishido, T. Ikeda, N. Miyazaki
20093 citations Open access
Semantic Scholar
Application of the Nonlinear Fracture Mechanics Parameter ΔT* to Wire-liftoff Lifetime Estimation of Power Modules at Elevated Temperatures
Nobuyuki Shishido, Yutaka Hayama, Akinaga Yuki, S. Taketomi +3 more
2024Journal of Electronic Packaging2 citations
Semantic Scholar
Examination of evaluation parameter for thermal fatigue life of wirebond used in power module
T. Osako, Y. Setoguchi, Nobuyuki Shishido, M. Koganemaru +3 more
2019The Proceedings of The Computational Mechanics Conference2 citations Open access
Semantic Scholar
Thermal fatigue analysis for aluminium wire bonding of power modules considering transient creep
Y. Setoguchi, Nobuyuki Shishido, M. Koganemaru, T. Ikeda +2 more
20182 citations Open access
Semantic Scholar
Macroscopic and microscopic interface adhesion strength of copper damascene interconnects
Nobuyuki Shishido, S. Kamiya, Chuan-Tong Chen, Hisashi Sato +6 more
2013International Interconnect Technology Conference2 citations
Semantic Scholar
Effect of Hydrogen on the Mechanical Properties of Silicon Crystal Surface
H. Izumi, Ryota Mukaiyama, Nobuyuki Shishido, S. Kamiya
20132 citations
Semantic Scholar
Specimen size effect of interface strength distribution induced by grain structure of Cu line
Chuan-Tong Chen, Nobuyuki Shishido, K. Koiwa, S. Kamiya +7 more
20132 citations Open access
Semantic Scholar
Strain measurement in micro-electronic packages using the digital image correlation method
T. Ikeda, Toshifumi Kanno, Nobuyuki Shishido, N. Miyazaki +2 more
20112 citations Open access
Semantic Scholar
concentration of gelatin solutions by dynamic ultrafiltration membranes.
Tohru Imanara, Nobuyuki Shishido, Tomohiko Kikkawa, Y. Yahiro +1 more
19902 citations Open access
Semantic Scholar
Trend in thermal resistance of advanced power modules
Nobuyuki Shishido, M. Tsukuda, S. Nishizawa
20191 citations
Semantic Scholar
Thermal elasto-plastic creep analysis for Al wirebond used in power module
Y. Setoguchi, Nobuyuki Shishido, Yû Suzaki, M. Koganemaru +3 more
20171 citations Open access
Semantic Scholar
Evaluation of adhesion energy and its correlation to apparent strength for Cu/SiN interface in copper damascene interconnect structures
S. Kamiya, Chuan-Tong Chen, Nobuyuki Shishido, M. Omiya +6 more
20152015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)1 citations
Semantic Scholar
An analysis of local deformation of SnAgCu solder joint using digital image correlation
Nobuyuki Shishido, Toshifumi Kanno, S. Kawahara, T. Ikeda +6 more
20102010 11th International Conference on Electronic Packaging Technology & High Density Packaging1 citations
Semantic Scholar
Accuracy improvement of full-field displacement measurement using digital image correlation for images obtained with a laser scanning confocal microscope
Nobuyuki Shishido, T. Ikeda, N. Miyazaki
2007International Conference on Electronic Materials and Packaging1 citations
Semantic Scholar
Effective methods of washing and removing a dynamic ultrafiltration membrane.
Tohru Imanara, Nobuyuki Shishido, Tomohiko Kikkawa, T. Hirota +1 more
19901 citations Open access
Semantic Scholar
Wire-Liftoff Lifetime Estimation Based on Thermal Fatigue Crack Growth: Proposal of Estimation Methodology Using Nonlinear Fracture Mechanics Parameter ΔT*
Nobuyuki Shishido, Akinaga Yuki, Shohei Jitsuyama, S. Hagihara +4 more
2025Journal of The Japan Institute of Electronics Packaging0 citations
Semantic Scholar
Proposal of Evaluation Method for Wire-Liftoff Lifetime of Power Modules Using Cyclic 4-Point-Bending Fatigue Test
M. Koganemaru, Nobuyuki Shishido, Tomoki Sakaguchi, Masaya Kato +4 more
2022Journal of The Japan Institute of Electronics Packaging0 citations Open access
Semantic Scholar
Application of Creep Multi-linear Rule to ORNL Modified Strain Hardening of Al Wire Bonding in Power Module
Yutaka Hayama, Nobuyuki Shishido, S. Hagihara, N. Miyazaki
2021The Proceedings of The Computational Mechanics Conference0 citations Open access
Semantic Scholar
Evaluation of Leakage Current and Leakage Path of Gate-Insulating Layer Used in Organic Thin-Film Transistors under Mechanical Loading
K. Hidaka, M. Koganemaru, Tomohito Sekine, Nobuyuki Shishido +4 more
2021Journal of The Japan Institute of Electronics Packaging0 citations Open access
Semantic Scholar
Discussion on the Test Methodologies for Structural Integrity of Power Module
N. Miyazaki, M. Koganemaru, Nobuyuki Shishido, Tomoki Sakaguchi +2 more
2021Journal of The Japan Institute of Electronics Packaging0 citations Open access
Semantic Scholar
Power module lifetime evaluation methodologies
N. Miyazaki, Nobuyuki Shishido, Yutaka Hayama
2021SiC Power Module Design: Performance, Robustness and Reliability0 citations
Semantic Scholar
Methodologies for Structural Integrity Evaluation of Power Semiconductor Modules
N. Miyazaki, Nobuyuki Shishido, Yutaka Hayama
20200 citations Open access
Semantic Scholar
Application of Modified Strain Hardening Rule to Thermal Fatigue Strength Evaluation of Wire Bonding in Power Module
Yutaka Hayama, Nobuyuki Shishido, K. Ushio, S. Hagihara +1 more
2020Journal of Smart Processing0 citations Open access
Semantic Scholar
Application of Nonlinear Fracture Mechanics to Mechanical Reliability Evaluation of Power Device
Nobuyuki Shishido, Yutaka Hayama, S. Hagihara, N. Miyazaki
2019The Proceedings of The Computational Mechanics Conference0 citations Open access
Semantic Scholar
Performance deterioration behavior of printed organic semiconductor flexible micro transistor under repeated bending deformation
Wan-Li Li, Qing-Qing Sun, S. Kamiya, Nobuyuki Shishido +4 more
2019The Proceedings of Mechanical Engineering Congress Japan0 citations Open access
Semantic Scholar
Evaluation of Thermal Fatigue Strength by Fracture Mechanics Parameter on Wire Bonding of Power Module
Yutaka Hayama, Nobuyuki Shishido, Wataru Morooka, S. Hagihara +1 more
20180 citations Open access
Semantic Scholar
Compression Test of Submicrometer Spherical Particles using SEM Nanoindenter
D. Nakamura, Nobuyuki Shishido, S. Kamiya, Y. Ishikawa +1 more
20180 citations Open access
Semantic Scholar
Evaluation of bending deformation and fracture behavior on multilayered thin film structure using mechanoluminescence
H. Izumi, Y. Haga, Nobuyuki Shishido, S. Kamiya
20180 citations Open access
Semantic Scholar
Damage on printed organic thin-film transistor due to bending deformation and the degradation of electric properties
Nobuyuki Shishido, H. Izumi, Tomohito Sekine, H. Sugiyama +2 more
20180 citations Open access
Semantic Scholar
Fabrication and Fracture Strength Measurement of TiC Submicrometer Spherical Particles by Pulsed Laser Melting in Liquid
D. Nakamura, N. Koshizaki, Nobuyuki Shishido, S. Kamiya
20180 citations
Semantic Scholar
Bending Fatigue Behavior and its Characterization of Silver Particle Wirings Printed on Flexible Substrate
S. Kamiya, H. Izumi, Tomohito Sekine, H. Sugiyama +3 more
20180 citations Open access
Semantic Scholar

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