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Takashi Suzuki · SciRah

Researcher profile · Semantic Scholar

Takashi Suzuki

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Takashi Suzuki — researcher profile on SciRah

h-index: 10
Works: 75
Citations: 331

Most-cited papers

60 and 77GHz Power Amplifiers in Standard 90nm CMOS
Takashi Suzuki, Y. Kawano, Masaru Sato, T. Hirose +1 more
2008IEEE International Solid-State Circuits Conference81 citations
Semantic Scholar
$W$ -band Transmitter and Receiver for 10-Gb/s Impulse Radio With an Optical-Fiber Interface
Yasuhiro Nakasha, Masaru Sato, T. Tajima, Y. Kawano +5 more
2009IEEE transactions on microwave theory and techniques33 citations
Semantic Scholar
The influence of the size effect of copper interconnects on RC delay variability beyond 45nm technology
H. Kitada, Takashi Suzuki, Takahiro Kimura, H. Kudo +12 more
20072007 IEEE International Interconnect Technology Conferencee24 citations
Semantic Scholar
Stress migration phenomenon in narrow copper interconnects
Takashi Suzuki, Tomoji Nakamura, Y. Mizushima, T. Kouno +5 more
200718 citations
Semantic Scholar
Simple Modeling and Characterization of Stress Migration Phenomena in Cu Interconnects
H. Tsuchikawa, Y. Mizushima, Tomoji Nakamura, Takashi Suzuki +1 more
200617 citations Open access
Semantic Scholar
Grain-scale adhesion strength mapping of copper wiring structures in integrated circuits
S. Kamiya, Nobuyuki Shishido, S. Watanabe, Hisashi Sato +7 more
201316 citations
Semantic Scholar
Influence of Titanium Liner on Resistivity of Copper Interconnects
H. Kitada, Takashi Suzuki, S. Akiyama, Tomoji Nakamura
200911 citations Open access
Semantic Scholar
Small angle X-ray scattering measurements of porous low-k films using synchrotron radiation
Takashi Suzuki, K. Omote, Y. Ito, I. Hirosawa +4 more
200611 citations
Semantic Scholar
A comparative study of a new microscale technique and conventional bending techniques for evaluating the interface adhesion strength in IC metallization systems
S. Kamiya, Hiroshi Shimomura, M. Omiya, Takashi Suzuki
201010 citations
Semantic Scholar
New Degradation Phenomena of Stress-Induced Voiding Inside via in Copper Interconnects
H. Matsuyama, M. Shiozu, T. Kouno, Takashi Suzuki +7 more
20072007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual10 citations
Semantic Scholar
Experimental and numerical evaluation of interfacial adhesion on Cu/SiN in LSI interconnect structures
M. Omiya, K. Koiwa, Nobuyuki Shishido, S. Kamiya +7 more
2013Microelectronics and reliability7 citations
Semantic Scholar
W-band transmitter and receiver modules for 10-Gb/s impulse radio
Yasuhiro Nakasha, Masaru Sato, T. Tajima, Y. Kawano +5 more
2009IEEE MTT-S International Microwave Symposium Digest7 citations
Semantic Scholar
Defects in Electroplated Cu and Their Impact on Stress Migration Reliability Studied using Monoenergetic Positron Beams
A. Uedono, Takashi Suzuki, Tomoji Nakamura, T. Ohdaira +1 more
20077 citations
Semantic Scholar
A 25-GHz, 40-mW Fully-Integrated Power Amplifier in Standard 90-nm Si-CMOS Technology
Y. Kawano, Takashi Suzuki, Yasuhiro Nakasha, Tatsuya Hirose +1 more
20072007 Korea-Japan Microwave Conference7 citations
Semantic Scholar
Copper dual damascene interconnects with very low-k dielectrics targeting for 130 nm node
H. Kudo, Y. Yoshie, S. Yamaguchi, K. Watanabe +11 more
2000Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407)6 citations
Semantic Scholar
High RF power transistor with laterally modulation-doped channel and self-aligned silicide in 45nm node CMOS technology
M. Shima, Takashi Suzuki, Y. Kawano, K. Okabe +3 more
20082008 IEEE International Electron Devices Meeting5 citations
Semantic Scholar
High manufacturability Cu multilevel interconnects featuring hybrid-NCS structure
I. Sugiura, N. Misawa, S. Otsuka, N. Nishikawa +22 more
20055 citations
Semantic Scholar
Integration of High Performance CMOS Logic LSI by Applying Cu Wiring to SiLKT.M./SiO2 Hybrid Structure
Masanobu Ikeda, Kenichi Watanabe, Y. Kotani, M. Kawano +10 more
20025 citations Open access
Semantic Scholar
Micro-scale evaluation of interface strength on the patterned structures in LSI interconnects
S. Kamiya, Hisashi Sato, M. Nishida, Chuan-Tong Chen +6 more
20104 citations
Semantic Scholar
20-GHz, 20-dBm pseudo-differential power amplifier in standard 90-nm CMOS
Y. Kawano, Takashi Suzuki, Masaru Sato, Yasuhiro Nakasha +3 more
2008Asia-Pacific Microwave Conference4 citations
Semantic Scholar
Investigation of continuous deformation behavior around initial yield point of single crystal copper by using micro scale torsion test
K. Koiwa, Nobuyuki Shishido, Chuan-Tong Chen, M. Omiya +7 more
20163 citations
Semantic Scholar
Re-think stress migration phenomenon with stress measurement in 12 years
H. Matsuyama, Takashi Suzuki, Tomoji Nakamura, M. Shiozu +1 more
20152015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)3 citations
Semantic Scholar
Specimen size effect on elastic–plastic strength evaluation of interface between thin films
Chuan-Tong Chen, K. Koiwa, Nobuyuki Shishido, S. Kamiya +7 more
20143 citations
Semantic Scholar
Crystal orientation effect on local adhesion strength of the interface between a damascene copper line and the insulation layer
Nobuyuki Shishido, Y. Oura, Hisashi Sato, S. Kamiya +7 more
20143 citations
Semantic Scholar
Evaluation for interface strength fluctuations induced by inhomogeneous grain structure of Cu line in LSI Interconnects
Chuan-Tong Chen, Nobuyuki Shishido, S. Kamiya, K. Koiwa +7 more
20143 citations
Semantic Scholar
Development of Cu/Insulation Layer Interface Crack Extension Simulation with Crystal Plasticity
K. Koiwa, M. Omiya, Nobuyuki Shishido, S. Kamiya +6 more
20133 citations
Semantic Scholar
Further Enhancement of Electro-migration Resistance by Combination of Self-aligned Barrier and Copper Wiring Encapsulation Techniques for 32-nm Nodes and Beyond
H. Kudo, M. Haneda, T. Tabira, Michie Sunayama +13 more
2008International Interconnect Technology Conference3 citations
Semantic Scholar
Characterization of Vacancy Defects in Electroplated Cu Films by Positron Annihilation and its Impact on Stress Migration Reliability
Takashi Suzuki, T. Nakamura, Y. Mizushima, T. Kouno +2 more
20063 citations
Semantic Scholar
Stress migration phenomena in narrow copper lines
H. Matsuyama, T. Kouno, Takashi Suzuki, M. Shiozu +7 more
2006IEEE International Integrated Reliability Workshop Final Report3 citations
Semantic Scholar
Thermal Expansion Coefficients of Nano-Clustering Silica (NCS) Films Measured by X-Ray Reflectivity and Substrate Curvature Methods
Takashi Suzuki, I. Sugiura, S. Sato, Tomoji Nakamura
20043 citations Open access
Semantic Scholar
A self-aligned cap technology for Cu damascene interconnects by MO-CVD ZrN film
H. Kondo, Yoshiyuki Nakao, Takashi Suzuki, H. Sakai +1 more
2002Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519)3 citations
Semantic Scholar
Macroscopic and microscopic interface adhesion strength of copper damascene interconnects
Nobuyuki Shishido, S. Kamiya, Chuan-Tong Chen, Hisashi Sato +6 more
2013International Interconnect Technology Conference2 citations
Semantic Scholar
Specimen size effect of interface strength distribution induced by grain structure of Cu line
Chuan-Tong Chen, Nobuyuki Shishido, K. Koiwa, S. Kamiya +7 more
20132 citations Open access
Semantic Scholar
Height Dependent Resistivity of Copper Interconnects in the Size Effect
H. Kitada, Takashi Suzuki, Takahiro Kimura, Tomoji Nakamura
20072 citations
Semantic Scholar
Verification of Copper Stress Migration Under Low Temperature Long Time Stress
H. Matsuyama, Takashi Suzuki, M. Shiozu, H. Ehara +4 more
2019IEEE International Reliability Physics Symposium1 citations
Semantic Scholar
Voiding generation in copper interconnect under room temperature storage in 12 years
H. Matsuyama, Takashi Suzuki, Tomoji Nakamura, M. Shiozu +5 more
20171 citations
Semantic Scholar
Evaluation of adhesion energy and its correlation to apparent strength for Cu/SiN interface in copper damascene interconnect structures
S. Kamiya, Chuan-Tong Chen, Nobuyuki Shishido, M. Omiya +6 more
20152015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)1 citations
Semantic Scholar
Copper Wiring Encapsulation with Ultra-thin Barriers to Enhance Wiring and Dielectric Reliabilities for 32-nm Nodes and Beyond
H. Kudo, M. Haneda, H. Ochimizu, Atsuhiro Tsukune +12 more
20072007 IEEE International Electron Devices Meeting1 citations
Semantic Scholar
Re-think Stress migration phenomenon with Stress measurement in 12years
H. Matsuyama, Takashi Suzuki, Tomoji Nakamura, Shiozu Motoki +1 more
20160 citations
Semantic Scholar
J2210405 Torsion test of single crystal copper to observe dislocation motion under stress distribution
T. Yokoyama, Nobuyuki Shishido, K. Koiwa, S. Kamiya +6 more
20150 citations Open access
Semantic Scholar
Scenario for catastrophic failure in interconnect structures under chip package interaction
M. Omiya, S. Kamiya, Nobuyuki Shishido, K. Koiwa +6 more
2015IEEE International Reliability Physics Symposium0 citations
Semantic Scholar
Microscale torsion test to investigate initial yielding phenomenon of a single crystal copper
T. Yokoyama, Nobuyuki Shishido, K. Koiwa, S. Kamiya +6 more
2015Microscopy and Microanalysis0 citations Open access
Semantic Scholar
J2240406 Grain size effect on the distribution of local adhesion strength in copper interconnects structure
Nobuyuki Shishido, Hisashi Sato, M. Nishida, S. Kamiya +6 more
20140 citations Open access
Semantic Scholar
Local distribution of residual stress of Cu in LSI interconnect
Hisashi Sato, Nobuyuki Shishido, S. Kamiya, K. Koiwa +5 more
20140 citations
Semantic Scholar
J2240407 Evaluation of mechanical energy required to separate Cu/SiN interface on different crystal orientations
Chuan-Tong Chen, Nobuyuki Shishido, K. Koiwa, S. Kamiya +7 more
20140 citations Open access
Semantic Scholar
OS1108 Development of evaluation method for copper crystal plasticity with small-scale specimens
K. Koiwa, M. Omiya, Chuan-Tong Chen, Nobuyuki Shishido +7 more
20140 citations Open access
Semantic Scholar
303 Influence of local deformation at grain boundary on adhesion strength of the Cu/SiN interface in LSI interconnect
Makoto Hanai, Nobuyuki Shishido, S. Kamiya, Hisashi Sato +7 more
20140 citations Open access
Semantic Scholar
OS1218 Evaluation of adhesion strength at a point of Cu/ insulation layer interface in LSI by crack extension simulation with Cu crystal plasticity
Y. Ando, K. Koiwa, M. Omiya, Nobuyuki Shishido +7 more
20130 citations Open access
Semantic Scholar
535 Evaluation of the effect of copper grain structure to Cu/SiN interfacial adhesion strength in LSI using crack propagation simulation
M. Namsrai, K. Koiwa, M. Omiya, Nobuyuki Shishido +7 more
20130 citations Open access
Semantic Scholar
534 Influence of Cu Crystal Orientation on Local Adhesion Strength of Interface Between Cu and SiN Semiconductor Device Wirings
Y. Oura, H. Sugiyama, Nobuyuki Shishido, S. Kamiya +8 more
20130 citations Open access
Semantic Scholar

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S. Kamiya×23
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Hisashi Sato — researcher profile on SciRah

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K. Koiwa — researcher profile on SciRah

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Toshiaki Suzuki×15

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Chuan-Tong Chen×10

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H. Matsuyama×9

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