A. Achen

Most-cited papers

1. Benzocyclobutene (DVS-BCB) polymer as an interlayer dielectric (ILD) material

   M. Mills, P. Townsend, D. Castillo, S. Martin +1 more

   1997120 citations

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2. Singlemode optical waveguides using a high temperature stable polymer with low losses in the 1.55 /spl mu/m range

   G. Fischbeck, R. Moosburger, C. Kostrzewa, A. Achen +1 more

   1997106 citations

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3. SEMI-ACTIVE VEHICLE CAB SUSPENSION USING MAGNETORHEOLOGICAL (MR) TECHNOLOGY

   A. Achen, James R. Toscano, Robert H. Marjoram, K. S. St. Clair +3 more

   200814 citations Open access

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4. Water Solubility and Diffusivity in BCB Resins used in Microelectronic Packaging and Sensor Applications

   A. Tetelin, A. Achen, V. Pouget, C. Pellet +2 more

   20052005 IEEE Instrumentationand Measurement Technology Conference Proceedings13 citations

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5. Interfacial adhesion analysis of BCB/TiW/Cu/PbSn technology in waferlevel packaging

   Michael Topper, A. Achen, Herbert Reichl

   200353rd Electronic Components and Technology Conference, 2003. Proceedings.9 citations

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6. Mcm-D Technology for a Communication Application

   W. Radlik, K. Plehnert, M. Zellner, A. Achen +3 more

   1994Proceedings of the International Conference on Multichip Modules7 citations

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7. Capacitive humidity sensors based on oxidized PhotoBCB polymer films: enhanced sensitivity and response time

   A. Tetelin, C. Pellet, A. Achen, M. Toepper

   2005Italian National Conference on Sensors6 citations

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8. Thermally Conductive Composite Material With Percolating Microparticles Applied as Underfill

   Rahel Straessle, S. Zimmermann, Luca del Carro, J. Zürcher +5 more

   2018IEEE Transactions on Components, Packaging, and Manufacturing Technology5 citations

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9. Electromigration and adhesion improvements of thick Cu/BCB architecture in BiCMOS RF technology

   L. Dumas, S. Verrier, A. Achen, J. Hetzner +8 more

   20063 citations

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10. A novel positive-tone and aqueous-base-developable photosensitive benzocyclobutene-based material for microelectronics

    Ying So, Edmund J. Stark, S. Thurston, T. Stokich +12 more

    2004Electronic Packaging Technology Conference3 citations

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11. Review of percolating and neck-based underfills with thermal conductivities up to 3 W/m-K

    T. Brunschwiler, Jonas Zurcher, S. Zimmermann, B. Burg +13 more

    2016Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems2 citations

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12. Materials for 300 mm wafer Level Packaging technologies

    M. Töpper, A. Achen, C. Lopper, Veronika Glaw +3 more

    20022 citations

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13. Benzocyclobutene (BCB) based polymer with enhanced toughness

    Ying So, J. Im, P. Garrou, J. Hetzner +9 more

    20001 citations

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14. P‐59: Aqueous‐Base‐Developable Benzocyclobutene (BCB)‐Based Material for Display Applications

    Ying So, Edmund J. Stark, Yongfu Li, S. Kisting +6 more

    20060 citations

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15. X-IGA: Consumer price packaging for 40Gbit/s transceiver modules?

    G. Meyer-Berg, Ivo Koren, H. Hedler, H. Hübner +2 more

    20030 citations

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16. Practice report on a high volume consumer MCP and substrate selection

    G. Meyer-Berg, D. Chin, S. Persson, A. Achen

    20010 citations

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