T. Stokich

Most-cited papers

1. On the Mechanical Reliability of Photo-BCB-Based Thin Film Dielectric Polymer for Electronic Packaging Applications

   J. Im, E. Shaffer, T. Stokich, A. Strandjord +7 more

   200038 citations

   Semantic Scholar

   Save

2. Real-Time FT-IR Studies Of The Reaction Kinetics For The Polymerization Of Divinyl Siloxane Bis-Benzocyclobutene Monomers

   T. Stokich, W. M. Lee, R. Peters

   199133 citations

   Semantic Scholar

   Save

3. An instrument for precise measurement of viscoelastic properties of low viscosity dilute macromolecular solutions at frequencies from 20 to 500 kHz

   T. Stokich, D. Radtke, C. White, J. Schrag

   199432 citations

   Semantic Scholar

   Save

4. Planarization with Cyclotene™ 3022 (BCB) Polymer Coatings

   T. Stokich, C. Fulks, M. Bernius, D. Burdeaux +2 more

   199320 citations

   Semantic Scholar

   Save

5. Molecular Topology Fractionation of Polystyrene Stars and Long Chain Branched Polyethylene Fractions

   D. Meunier, T. Stokich, D. Gillespie, Patrick B. Smith

   200716 citations

   Semantic Scholar

   Save

6. Local modification of solvent dynamics by polymeric solutes

   J. Schrag, T. Stokich, D. Strand, P. Merchak +9 more

   199114 citations

   Semantic Scholar

   Save

7. Studies of the concentration dependence of the conformational dynamics of solutions containing linear, star or comb homopolymers

   C. J. T. Martel, T. Lodge, M. Dibbs, T. Stokich +3 more

   198314 citations

   Semantic Scholar

   Save

8. BenzoCycloButene (BCB): a polymeric system for passive optical interconnects

   C. A. Langhoff, T. Stokich, B. Heistand

   1993Photonics West - Lasers and Applications in Science and Engineering13 citations

   Semantic Scholar

   Save

9. Adhesion of Cyclotene™ (BCB) Coatings on Silicon Substrates

   P. Townsend, D. Schmidt, T. Stokich, S. Kisting +5 more

   19939 citations

   Semantic Scholar

   Save

10. Characterization of the surface structural, mechanical, and thermal properties of benzocyclobutene dielectric polymers using scanned probe microscopy

    G. Meyers, M. Dineen, Edward O. Ii Shaffer, T. Stokich +1 more

    20018 citations

    Semantic Scholar

    Save

11. Cure Technology for Controlled Stress in Thin Benzocyclobutene Coatings

    P. Townsend, D. Burdeaux, T. Stokich, M. Dibbs

    19928 citations

    Semantic Scholar

    Save

12. Mechanical Behavior of Benzocyclobutene Films on Silicon Substrates

    P. Townsend, T. Stokich, B. Huber

    19917 citations

    Semantic Scholar

    Save

13. Inner-shell excitation spectroscopy and X-ray photoemission electron microscopy of adhesion promoters.

    David V. Tulumello, G. Cooper, I. Koprinarov, A. Hitchcock +5 more

    2005Journal of Physical Chemistry B6 citations Open access

    Semantic Scholar

    Save

14. Design of Nanoporous Polyarylene Polymers for Use as Low-k Dielectrics in Microelectronic Devices

    H. Silvis, Kevin J. Bouck, J. Godschalx, Q. Niu +6 more

    20044 citations

    Semantic Scholar

    Save

15. Development of porous SiLK™ Semiconductor Dielectric Resin for the 65 nm and 45 nm Nodes

    R. Strittmatter, J. Hahnfeld, H. Silvis, T. Stokich +10 more

    20034 citations

    Semantic Scholar

    Save

16. A novel positive-tone and aqueous-base-developable photosensitive benzocyclobutene-based material for microelectronics

    Ying So, Edmund J. Stark, S. Thurston, T. Stokich +12 more

    2004Electronic Packaging Technology Conference3 citations

    Semantic Scholar

    Save

17. Dissociation kinetics of metal ion-2,6-dicarboxypiperidineacetic acid complexes: nickel(II) and cadmium(II)

    T. J. Bydalek, T. Stokich, D. Coleman

    19703 citations

    Semantic Scholar

    Save

18. Development and Application of On-Wafer Small Angle X-Rayscattering for the Quantification of Pore Morphology in Low Kporous Silk Semiconductor Dielectrics

    B. Landes, B. Kern, T. Stokich, Jason Niu +8 more

    20032 citations

    Semantic Scholar

    Save

19. Integration of a low permittivity spin-on embedded hardmask for Cu/SiLK resin dual damascene

    Joost Waeterloos, E. Shaffer, T. Stokich, Jack E. Hetzner +14 more

    2001Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461)2 citations

    Semantic Scholar

    Save

20. Advances in the Thermal-Oxidative Stabilization of Divinyl Siloxane Bis-Benzocyclobutene Polymer Coatings

    T. Stokich, D. Burdeaux, C. Mohler, P. Townsend +6 more

    19922 citations

    Semantic Scholar

    Save

21. Physical and Interfacial Properties of Low Permittivity Polymers: Silk and Ultra-Low K

    D. Frye, J. Waeterloos, M. Simmonds, T. Stokich +1 more

    20020 citations

    Semantic Scholar

    Save

22. Mechanical analysis of a SiLK/Cu dual damascene interconnect system

    J. Waeterloos, E. Shaffer, T. Stokich, R. Donaton +1 more

    20000 citations

    Semantic Scholar

    Save

23. Organic Polymer Dielectrics in Microelectronic Technologies: Reliability Requirements, Testing, and Qualification

    P. Townsend, R. Heistand, D. Castillo, T. Stokich +9 more

    19940 citations

    Semantic Scholar

    Save

24. 非気密パッケージ用Cyclotene・3022(BCB)

    R. Heistand, R. Devellis, P. Garrou, D. Burdeaux +5 more

    19920 citations

    Semantic Scholar

    Save