Jaewon Chang

Most-cited papers

1. New Sn–0.7Cu-based solder alloys with minor alloying additions of Pd, Cr and Ca

   J. Koo, Jaewon Chang, Young-Woo Lee, S. Hong +2 more

   201440 citations

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2. Phase Equilibria in the Sn-Ni-Zn Ternary System: Isothermal Sections at 200°C, 500°C, and 800°C

   Jaewon Chang, S. Seo, Hyuck Mo Lee

   201032 citations

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3. Development of a roller hearth furnace simulation model and performance investigation

   Jaewon Chang, Jinwoo Oh, Hoseong Lee

   202022 citations

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4. Investigation of Sn Whisker Growth in Electroplated Sn and Sn-Ag as a Function of Plating Variables and Storage Conditions

   Jaewon Chang, Sung K. Kang, Jae-Ho Lee, Keun-Soo kIM +1 more

   2013Journal of Electronic Materials8 citations

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5. Minor alloying effects of Ni or Zn on microstructure and microhardness of Pb-free solders

   S. Seo, M. Cho, Sung K. Kang, Jaewon Chang +1 more

   2011Electronic Components and Technology Conference6 citations

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6. Optimal design of dummy ball array in wafer level package to improve board level thermal cycle reliability (BLR)

   Seongwon Jeong, Jinseok Kim, A. Kim, Byungwook Kim +7 more

   2018IEEE International Reliability Physics Symposium3 citations

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7. Recrystallization as a Growth Mechanism for Whiskers on Plastically Deformed Sn Films

   Jaewon Chang, Sung K. Kang, Jae-Ho Lee, Keun-Soo kIM +1 more

   2015Journal of Electronic Materials3 citations

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8. Effects of Be and Co addition on the growth of Sn whiskers and the properties of Sn-based Pb-free solders

   Jaewon Chang, S. Seo, M. Cho, Dong Nyung Lee +2 more

   20123 citations

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9. Plastic deformation effect on Sn whisker growth in electroplated Sn and Sn-Ag solders

   Sung K. Kang, Jaewon Chang, Jae-Ho Lee, Keun-Soo kIM +1 more

   20132013 IEEE 63rd Electronic Components and Technology Conference1 citations

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10. Three-dimensional (3D) Characterization of Electromigration Failure Mechanism of Solder Joints in WLP using X-ray Microscopy

    Jaewon Chang, Hyunjun Choi, Jinseok Kim, Sangkwon Park +7 more

    2018International Symposium on the Physical and Failure Analysis of Integrated Circuits0 citations

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11. Sn-Ni-Zn : A Key System for High-temperature Soldering

    Jaewon Chang, Seungju Seo, Hyuck Mo Lee

    20100 citations

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