J. Bai

Most-cited papers

Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material
J. Bai, Zhiye Zhang, Jesus N. Calata, Guo-Quan Lu
2006IEEE transactions on components and packaging technologies359 citations
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Thermomechanical Reliability of Low-Temperature Sintered Silver Die Attached SiC Power Device Assembly
J. Bai, Guo-Quan Lu
2006IEEE transactions on device and materials reliability205 citations
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High-Temperature Operation of SiC Power Devices by Low-Temperature Sintered Silver Die-Attachment
J. Bai, Jian Yin, Zhiye Zhang, Guo-Quan Lu +1 more
2007IEEE Transactions on Advanced Packaging168 citations
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Processing and Characterization of Nanosilver Pastes for Die-Attaching SiC Devices
J. Bai, Jesus N. Calata, Guo-Quan Lu
2007IEEE transactions on electronics packaging manufacturing (Print)141 citations
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Circumferential-mode, quasi-ring-type, magnetoelectric laminate composite—a highly sensitive electric current and∕or vortex magnetic field sensor
S. Dong, J. Bai, J. Zhai, Jie-Fang Li +4 more
2005101 citations
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Control of nanosilver sintering attained through organic binder burnout
J. Bai, T. G. Lei, J. Calata, Guo-Quan Lu
200788 citations
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Three-dimensional packaging for power semiconductor devices and modules
Jesus N. Calata, J. Bai, Xing-Sheng Liu, Si-Hua Wen +1 more
2005IEEE Transactions on Advanced Packaging85 citations
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Inkjet printable nanosilver suspensions for enhanced sintering quality in rapid manufacturing
J. Bai, Kevin D. Creehan, H. Kuhn
200780 citations
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A lead-free, low-temperature sintering die-attach technique for high-performance and high-temperature packaging
Guo-Quan Lu, J. N. Calata, Zhiye Zhang, J. Bai
2004Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04)79 citations
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Mitigation of thermal lensing effect as a brightness limitation of high-power broad area diode lasers
J. Bai, P. Leisher, Shi-Guo Zhang, S. Elim +9 more
2011OPTO62 citations
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Characterization of Low-Temperature Sintered Nanoscale Silver Paste for Attaching Semiconductor Devices
J. Bai, Z.-Z. Zhang, J. N. Calata, Guo-Quan Lu
20052005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis45 citations
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Manipulation of nanoparticles and biomolecules by electric field and surface tension
Yaling Liu, K. Oh, J. Bai, Cheng-Ling Chang +4 more
200843 citations
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High reliability and high performance of 9xx-nm single emitter laser diodes
L. Bao, P. Leisher, Jun Wang, M. Devito +9 more
2011LASE37 citations
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Flip-chip on flex integrated power electronics modules for high-density power integration
J. Bai, Guo-Quan Lu, Xing-Sheng Liu
200335 citations
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Thermomechanical reliability of low-temperature sintered silver die-attachment
J. Bai, J. Calata, G. Lei, Guo-Quan Lu
2006Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006.32 citations
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Measurement of Solder/Copper Interfacial Thermal Resistance by the Flash Technique
J. Bai, Z.-Z. Zhang, Guo-Quan Lu, D. Hasselman
200529 citations
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Magneto-optical current sensing for applications in integrated power electronics modules
J. Bai, Guo-Quan Lu, Tao Lin
200329 citations
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Strategies for improving the reliability of solder joints on power semiconductor devices
Guo-Quan Lu, Xing-Sheng Liu, Si-Hua Wen, J. Calata +1 more
200427 citations
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Comparative thermal and thermomechanical analyses of solder-bump and direct-solder bonded power device packages having double-sided cooling capability
J. Bai, Jesus N. Calata, Guo-Quan Lu
2004Nineteenth Annual IEEE Applied Power Electronics Conference and Exposition, 2004. APEC '04.24 citations
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Reliability of high power/brightness diode lasers emitting from 790 to 980 nm
L. Bao, J. Bai, K. Price, M. Devito +10 more
2013Photonics West - Lasers and Applications in Science and Engineering22 citations
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High brightness fiber coupled pump modules optimized for optical efficiency and power
K. Price, M. Hemenway, L. Bao, J. Bai +4 more
2013Photonics West - Lasers and Applications in Science and Engineering21 citations
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High reliability of high power and high brightness diode lasers
Manoj Kanskar, L. Bao, J. Bai, Zhi-Gang Chen +12 more
2014Photonics West - Lasers and Applications in Science and Engineering18 citations
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Performance limitation and mitigation of longitudinal spatial hole burning in high-power diode lasers
Zhi-Gang Chen, L. Bao, J. Bai, M. Grimshaw +4 more
2012OPTO16 citations
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Nanostructured biosensing platform-shadow edge lithography for high-throughput nanofabrication.
J. Bai, W. Yeo, J. Chung
2009Lab on a Chip15 citations
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Low-Temperature Sintering of Nanoscale Silver Pastes for High-Performance and Highly-Reliable Device Interconnection
J. Bai, Zach Z. Zhang, J. Calata, Guo-Quan Lu
200514 citations
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Shadow edge lithography for nanoscale patterning and manufacturing
J. Bai, Cheng-Ling Chang, J. Chung, Kyong-Hoon Lee
200712 citations
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Discussion on the Reliability Issues of Solder-Bump and Direct-Solder Bonded Power Device Packages Having Double-Sided Cooling Capability
J. Bai, J. Calata, Guo-Quan Lu
200611 citations
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High power and high efficiency kW 88x-nm multi-junction pulsed diode laser bars and arrays
Zhi-Gang Chen, J. Bai, Wei-Min Dong, X. Guan +6 more
2014Photonics West - Lasers and Applications in Science and Engineering8 citations
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Low-Temperature Sintered Silver Attachment for High-Temperature Operation of SiC Power Devices
J. Bai, Zach Z. Zhang, Guo-Quan Lu, Jian Yin +3 more
20066 citations
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Strategies for Improving Reliability of Solder Joints on Power Semiconductor Devices
Guo-Quan Lu, Xing-Sheng Liu, Si-Hua Wen, J. Calata +1 more
20036 citations
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High efficiency kW-class QCW 88x nm diode laser bars
Manoj Kanskar, J. Bai, Zhi-Gang Chen, Wei-Min Dong +5 more
2013Conference on Lasers and Electro-Optics4 citations
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High-efficiency kW-class QCW 88x-nm diode semiconductor laser bars with passive cooling
J. Bai, Zhi-Gang Chen, P. Leisher, L. Bao +6 more
2012Photonics West - Lasers and Applications in Science and Engineering3 citations
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Determination of interfacial thermal resistivity by finite element modeling of the flash measurements
J. Bai, Zhiye Zhang, J. N. Calata, Guo-Quan Lu +1 more
2004The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543)3 citations
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Optimized performance of 808 nm diode laser bars for efficient high-power operation
J. Bai, L. Bao, Wei-Min Dong, X. Guan +8 more
2013Photonics West - Lasers and Applications in Science and Engineering2 citations
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High Efficiency kW-class QCW 88 x nm Diode Laser Bars with Passive Cooling
J. Bai, Zhi-Gang Chen, P. Leisher, L. Bao +6 more
20122 citations
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Brightness scaling of diodes lasers and fiber coupled modules at 9xx nm
K. Price, L. Bao, J. Bai, D. Dawson +2 more
20122012 IEEE Photonics Society Summer Topical Meeting Series1 citations
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Shadow Edge Lithography for Wafer-Scale Nanofabrication
J. Bai, J. Chung
20071 citations
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Ion diffusion upon concentrations in open nanofluidic channels
Cheng-Ling Chang, J. Bai, Kyong-Hoon Lee, J. Chung +2 more
20070 citations
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High power AlGaAs/GaAs laser diode array cm-bars and their thermal management
Hong-Yun Xie, J. Bai, Guo-Ying Chen, Guo-Feng Xin +1 more
2004The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543)0 citations
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