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K. Tatsumi · SciRah

Researcher profile · Semantic Scholar

K. Tatsumi

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K. Tatsumi — researcher profile on SciRah

h-index: 14
Works: 93
Citations: 764

Most-cited papers

Investigation of heavily nitrogen-doped n+ 4H-SiC crystals grown by physical vapor transport
N. Ohtani, Masakazu Katsuno, M. Nakabayashi, T. Fujimoto +6 more
200977 citations
Semantic Scholar
Role of interface in highly filled epoxy/BaTiO3 nanocomposites. Part I-correlation between nanoparticle surface chemistry and nanocomposite dielectric property
Xing-Yi Huang, Liyuan Xie, Ke Yang, Chao Wu +5 more
2014IEEE transactions on dielectrics and electrical insulation59 citations
Semantic Scholar
Electrical properties of epoxy/POSS composites with homogeneous nanostructure
Xing-Yi Huang, Yong Li, Fei Liu, Ping-Kai Jiang +3 more
2014IEEE transactions on dielectrics and electrical insulation50 citations
Semantic Scholar
Thermal reliability of gold - aluminum bonds encapsulated in bi-phenyl epoxy resin
Tomohiro Uno, K. Tatsumi
200048 citations
Semantic Scholar
Improvement of Thermal Fatigue Properties of Sn-Ag-Cu Lead-Free Solder Interconnects on Casio’s Wafer-Level Packages Based on Morphology and Grain Boundary Character
S. Terashima, T. Kohno, A. Mizusawa, K. Arai +4 more
200940 citations
Semantic Scholar
Role of interface in highly filled epoxy/BaTiO3 nanocomposites. Part II- effect of nanoparticle surface chemistry on processing, thermal expansion, energy storage and breakdown strength of the nanocomposites
Xing-Yi Huang, Liyuan Xie, Ke Yang, Chao Wu +5 more
2014IEEE transactions on dielectrics and electrical insulation39 citations
Semantic Scholar
Improvement in drop shock reliability of Sn-1.2Ag-0.5Cu BGA interconnects by Ni addition
Masamoto Tanaka, Tsutomu Sasaki, Takayuki Kobayashi, K. Tatsumi
2006Electronic Components and Technology Conference32 citations
Semantic Scholar
IMC Growth of Solid State Reaction between Ni UBM and Sn-3Ag-0.5Cu and Sn-3.5Ag Solder Bump Using Ball Place Bumping Method during Aging
S. Ishikawa, E. Hashino, Taro Kono, K. Tatsumi
200524 citations Open access
Semantic Scholar
Thermal fatigue properties and grain boundary character distribution in Sn–x Ag–0˙5Cu (x = 1, 1˙2 and 3) lead free solder interconnects
S. Terashima, Masamoto Tanaka, K. Tatsumi
200822 citations
Semantic Scholar
Growth of Crack-Free 100mm-Diameter 4H-SiC Crystals with Low Micropipe Densities
M. Nakabayashi, T. Fujimoto, Masakazu Katsuno, N. Ohtani +6 more
200822 citations
Semantic Scholar
Grain Refinement of High-Purity FCC Metals Using Equal-Channel Angular Pressing
Z. Horita, K. Kishikawa, K. Kimura, K. Tatsumi +1 more
200722 citations Open access
Semantic Scholar
Analysis and Design of a Minimalist Step Climbing Robot
Nayan Jyoti Baishya, B. Bhattacharya, H. Ogai, K. Tatsumi
2021Applied Sciences20 citations Open access
Semantic Scholar
Micro-ball bump for flip chip interconnections
K. Shimokawa, Eiji Hashino, Y. Ohzeki, K. Tatsumi
19981998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)15 citations
Semantic Scholar
Void formation and reliability in gold-aluminum bonding
Tomohiro Uno, K. Tatsumi, Y. Ohno
199215 citations
Semantic Scholar
Development of Packaging Technology for High Temperature Resistant SiC Module of Automobile Application
K. Tatsumi, M. Inagaki, K. Kamei, T. Iizuka +10 more
2017Electronic Components and Technology Conference14 citations
Semantic Scholar
High-Temperature-Resistant Interconnections Formed by Using Nickel Micro-plating and Ni Nano-particles for Power Devices
Noriyuki Kato, S. Hashimoto, T. Iizuka, K. Tatsumi
201314 citations Open access
Semantic Scholar
How different fillers affect the thermal conductivity of epoxy composites
I. Tsekmes, R. Kochetov, P. Morshuis, J. Smit +3 more
2014Conference on Electrical Insulation and Dielectric Phenomena12 citations
Semantic Scholar
The influence of coating solution and calcination condition on the durability of Ir1-xSnxO2/Ti anodes for oxygen evolution
Z. Kato, Ryosuke Kashima, K. Tatsumi, Shinnosuke Fukuyama +3 more
201611 citations
Semantic Scholar
Significant reduction of wire sweep using Ni plating to realise ultra fine pitch wire bonding
S. Terashima, Yukihiro Yamamoto, Tomohiro Uno, K. Tatsumi
2002Electronic Components and Technology Conference11 citations
Semantic Scholar
Improvement in thermal reliability of a flip chip interconnection system joined by Pb-free solder and Au bumps
S. Terashima, Tomohiro Uno, E. Hashino, K. Tatsumi
200111 citations Open access
Semantic Scholar
Micro-ball bumping technology for flip chip and TAB interconnections
K. Tatsumi, K. Shimokawa, E. Hashino, Y. Ohzeki +2 more
199911 citations
Semantic Scholar
Stacking Fault Formation in Highly Nitrogen-Doped 4H-SiC Substrates with Different Surface Preparation Conditions
Masakazu Katsuno, M. Nakabayashi, T. Fujimoto, N. Ohtani +5 more
200810 citations Open access
Semantic Scholar
Micro-ball wafer bumping for flip chip interconnection
Eiji Hashino, K. Shimokawa, Y. Yamamoto, K. Tatsumi
20012001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)10 citations
Semantic Scholar
High Temperature Resistant Packaging Technology for SiC Power Module by Using Ni Micro-Plating Bonding
K. Tatsumi, I. Morisako, K. Wada, Minoru Fukuomori +10 more
2019Electronic Components and Technology Conference9 citations
Semantic Scholar
The effect of nanosilica on the DC breakdown strength of epoxy based nanocomposites
R. Kochetov, I. Tsekmes, Lukasz Chmura, P. Morshuis +3 more
2014Conference on Electrical Insulation and Dielectric Phenomena9 citations
Semantic Scholar
Development of Lapping and Polishing Technologies of 4H-SiC Wafers for Power Device Applications
Hirokatsu Yashiro, T. Fujimoto, N. Ohtani, T. Hoshino +6 more
20089 citations
Semantic Scholar
Intermetallic growth and void formation in Au wire ball bonds to Al pads
Tomohiro Uno, K. Tatsumi
19999 citations Open access
Semantic Scholar
Filler‐dependent changes in thermal, dielectric, and mechanical properties of epoxy resin nanocomposites
Emiri Nagase, T. Iizuka, K. Tatsumi, N. Hirai +4 more
2020IEEJ TRANSACTIONS ON ELECTRICAL AND ELECTRONIC ENGINEERING8 citations Open access
Semantic Scholar
High temperature resistant interconnection for SiC power devices using Ni micro-electroplating and Ni nano particles
K. Tatsumi, Yasunori Tanaka, T. Iizuka, K. Wada +4 more
2018Electronics System-integration Technology Conference7 citations
Semantic Scholar
Micro-ball Bump Technology For Fine-pitch Interconnections
K. Shimokawa, K. Tatsumi, Eiji Hashino, Y. Ohzeki +2 more
1997IEMT/IMC Symposium, 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]7 citations
Semantic Scholar
Electroluminescence of Epoxy Resin Nanocomposite Under AC High Field
K. Tohyama, T. Iizuka, K. Tatsumi, Yasutomo Otake +3 more
2019Conference on Electrical Insulation and Dielectric Phenomena6 citations
Semantic Scholar
High-temperature-resistant interconnection using nickel nanoparticles
Yasunori Tanaka, S. Hashimoto, T. Iizuka, K. Tatsumi +3 more
20146 citations
Semantic Scholar
Surface analysis of epoxy nanocomposite insulator materials eroded by partial discharge
T. Iizuka, Yu-Qing Zhou, T. Maekawa, Toshikatsu Tanaka +1 more
2014Conference on Electrical Insulation and Dielectric Phenomena5 citations
Semantic Scholar
High Temperature Resistant Packaging for SiC Power Devices Using Interconnections Formed by Ni Micro-Electroplating
Noriyuki Kato, Shigenaga Akiyoshi, K. Tatsumi
20145 citations Open access
Semantic Scholar
Process integration of fine pitch Cu redistribution wiring and SnCu micro-bumping for power efficient LSI devices with high-bandwidth stacked DRAM
H. Ezawa, T. Togasaki, T. Migita, Soichi Yamashita +5 more
20135 citations
Semantic Scholar
Thermal bond reliability of high reliability gold alloy wires for automotive IC's
Tomohiro Uno, K. Kimura, K. Tatsumi
20055 citations
Semantic Scholar
Corrosion of Intermetallic Layer and Reliability of Au/Al Bonds
Tomohiro Uno, K. Tatsumi
19995 citations Open access
Semantic Scholar
DEPENDENCE OF GRAIN BOUNDARY SEGREGATION OF PHOSPHORUS ON TEMPERATURE AND GRAIN BOUNDARY MISORIENTATION IN alpha -IRON.
K. Tatsumi, N. Okumura, S. Funaki
19865 citations
Semantic Scholar
Design of an Anti-Slip Mechanism for Wheels of Step Climbing Robots
Nayan Jyoti Baishya, B. Bhattacharya, H. Ogai, K. Tatsumi
2021Actuators4 citations Open access
Semantic Scholar
Synthesis of SiC coating from SiO by a chemical vapor deposition (CVD) process
N. Murakawa, M. Eguchi, K. Tatsumi
20174 citations Open access
Semantic Scholar
Alloying behaviour of electroplated Ag film with its underlying Pd/Ti film stack for low resistivity interconnect metallization
H. Ezawa, M. Miyata, K. Tatsumi
20144 citations
Semantic Scholar
An Applicatin of Micro-Ball Wafer Bumping to Double Ball Bump for Flip Chip Interconnection
K. Tatsumi, Y. Yamamoto, K. Iwata, E. Hashino +4 more
2005Proceedings Electronic Components and Technology, 2005. ECTC '05.4 citations
Semantic Scholar
Improvement in thermal reliability in gold-aluminum bonds encapsulated in Bi-phenyl epoxy resin
Tomohiro Uno, S. Terashima, K. Onoue, K. Tatsumi
19984 citations
Semantic Scholar
Au/Al2O3/Al薄膜における金の拡散および金属間化合物生成の挙動
A. Tsuge, K. Mizuno, Tomohiro Uno, K. Tatsumi
19954 citations Open access
Semantic Scholar
Development of ultra-fine pitch ball bonding technology
K. Tatsumi, Tomohiro Uno, Osamu Kitamura, Y. Ohno +2 more
1995Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'4 citations
Semantic Scholar
High-temperature Resistant Interconnections Formed by Ni Nanoparticles/Al Micro-particles Composite Paste for SiC Power Device Application
Yasunori Tanaka, Tatsumasa Wakata, N. Murakawa, T. Iizuka +2 more
2022Transactions of The Japan Institute of Electronics Packaging3 citations Open access
Semantic Scholar
High-temperature resistant interconnection using Ni nanoparticles and Al microparticles paste sintered in an atmosphere
K. Koshiba, T. Iizuka, K. Tatsumi
2022Japanese Journal of Applied Physics3 citations Open access
Semantic Scholar
Lead-Free Solder Micro-Ball Bumps for the Next Generation of Flip Chip Interconnection: Micro-Ball Materials, Bump Formation Process and Reliability
S. Ishikawa, Tomoyuki Uchiyama, Eiji Hashino, T. Kohno +2 more
20072007 Proceedings 57th Electronic Components and Technology Conference3 citations
Semantic Scholar
Effect of Ni Addition on Bending Properties of Sn-Ag-Cu Lead-Free Solder Joints
Takayuki Kobayashi, Y. Kariya, Tsutomu Sasaki, Masamoto Tanaka +1 more
20072007 Proceedings 57th Electronic Components and Technology Conference3 citations
Semantic Scholar
50 μm fine pitch ball bonding technology
Tomohiro Uno, O. Kitamura, S. Terashima, K. Tatsumi
20013 citations
Semantic Scholar

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