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Y. Shimada · SciRah

Researcher profile · Semantic Scholar

Y. Shimada

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Y. Shimada — researcher profile on SciRah

h-index: 10
Works: 52
Citations: 284

Most-cited papers

Low Firing Temperature Multilayer Glass-Ceramic Substrate
Y. Shimada, K. Utsumi, M. Suzuki, H. Takamizawa +2 more
198360 citations
Semantic Scholar
Low dielectric constant multilayer glass-ceramic substrate with Ag-Pd wiring for VLSI package
Y. Shimada, Y. Yamashita, H. Takamizawa
198836 citations
Semantic Scholar
Low dielectric constant new materials for multilayer ceramic substrate
K. Kata, Y. Shimada, H. Takamizawa
1989Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International Electronic Manufacturing Technology Symposium28 citations
Semantic Scholar
New high-density multilayer technology on PCB
T. Shimoto, K. Matsui, K. Kikuchi, Y. Shimada +1 more
19981998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)24 citations
Semantic Scholar
Monolithic multicomponents ceramic (MMC) substrate
K. Utsumi, Y. Shimada, H. Takamizawa
198618 citations
Semantic Scholar
New probe microstructure for full-wafer, contact-probe cards
K. Soejima, M. Kimura, Y. Shimada, S. Aoyama
19991999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299)15 citations
Semantic Scholar
Fabrication of controlled porosity in a tape cast glass ceramic substrate material
J. K. Yamamoto, K. Kata, Y. Shimada
198913 citations
Semantic Scholar
Electrical design technology for low dielectric constant multilayer ceramic substrate
A. Sasaki, Y. Shimada
19911991 Proceedings 41st Electronic Components & Technology Conference12 citations
Semantic Scholar
MCM-D/L Technology Based on Cu/Benzocyclobutene Thin Film Multilayer Structure
K. Matsui, T. Shimoto, Y. Shimada, K. Utsumi
199511 citations
Semantic Scholar
Large scale multilayer glass-ceramic substrate for supercomputer
Y. Shimada, Y. Kobayashi, K. Kata, M. Kurano +1 more
199040th Conference Proceedings on Electronic Components and Technology11 citations
Semantic Scholar
Three-dimensional memory module
N. Takahashi, N. Senba, Y. Shimada, Ikushi Morisaki +1 more
19987 citations
Semantic Scholar
3-dimensional memory module
N. Takahashi, Naoji Senba, Y. Shimada, I. Morizaki +1 more
19961996 Proceedings 46th Electronic Components and Technology Conference6 citations
Semantic Scholar
Low Dielectric Constant Glass-Ceramic Composite Controled Isolated Porosity
K. Kata, Y. Shimada
19926 citations Open access
Semantic Scholar
Properties of the Large-Capacitance Multilayer Ceramic Capacitor
Y. Shimada, K. Utsumi, M. Yonezawa, H. Takamizawa
19826 citations Open access
Semantic Scholar
High-speed computer packaging with multilayer glass ceramic substrate
Y. Shimada, A. Dohya, T. Inoue, M. Abe +6 more
19934 citations
Semantic Scholar
The ferrite-embedded drop-in circulator for millimeter wave communication systems
Y. Okada, Y. Shimada, M. Furuya, O. Myoh +2 more
20002000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)3 citations
Semantic Scholar
Low dielectric constant multilayer glass-ceramic substrate controlled isolated porosity
K. Kata, Y. Shimada
19923 citations
Semantic Scholar
Application of multilayer ceramic components for fiber-optic transmitter/receiver
Y. Shimada, T. Shin'e, Y. Uda, R. Nagoaka
19913 citations
Semantic Scholar
Highly thermal conductive aluminum nitride substrate
Y. Kurokawa, H. Hamaguchi, Y. Shimada, K. Utsumi +1 more
19873 citations
Semantic Scholar
High frequency/high density build-up boards with benzocyclobutene [BCB] polymer coated Cu foil
Philip Garrou, Y. So, J. Im, K. Ohba +5 more
20002000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)2 citations
Semantic Scholar
3-Dimensional Memory Module Using CSP
Y. Shimada
19982 citations Open access
Semantic Scholar
New MCM composed of D/L base substrate, high-density-wiring CSP and 3D memory modules
A. Shibuya, Ichiro Hazeyama, T. Shimoto, N. Takahashi +5 more
19971997 Proceedings 47th Electronic Components and Technology Conference2 citations
Semantic Scholar
MCM technology based on Cu/benzocyclobuten thin-film multilayer structure
K. Matsui, T. Shimoto, Y. Shimada, K. Utsumi
19972 citations
Semantic Scholar
Metallization development and application for aluminum nitride substrates
Hiroaki Yamamoto, Y. Kurokawa, Y. Shimada, Tohru Kamata
1989Proceedings., 39th Electronic Components Conference2 citations
Semantic Scholar
Whether Glass Ceramic Substrate Has a Viable Commercial Future
Y. Shimada, K. Utsumi
19971 citations Open access
Semantic Scholar
Application for 3-Dimensional Memory Module
N. Senba, N. Takahashi, Y. Shimada, I. Morizaki +3 more
19961 citations
Semantic Scholar
Advanced glass-ceramic materials for high density multilayer glass-ceramic substrate
K. Utsumi, K. Ikuina, A. Shibuya, Y. Shimada
19951 citations
Semantic Scholar
Effect of MgO Addition on the Bondability and Interfacial Reaction between Dielectric and Glass-Ceramics for the Fabrication of Multi-Component Ceramic Substrates
Toshio Kimura, Y. Okada, Takashi Yamaguchi, Y. Shimada +1 more
19941 citations
Semantic Scholar
Ceramic Green Sheet Puncher Using Multilayer Piezoelectric Actuator
Kiminori Yoshida, T. Yoshiura, Y. Shimada
19871 citations Open access
Semantic Scholar
Effect of MgO Addition on the Bondability and Interfacial Reaction between Dielectric and Glass-Ceramics for the Fabrication of Multi-Component Ceramic Substrates *
Toshio Kimura, Y. Okada, Takashi Yamaguchi, Y. Shimada +1 more
2020Adhesion International 19930 citations
Semantic Scholar
High-performance Electronic Components and Materials for Smart Society
Y. Shimada
20200 citations Open access
Semantic Scholar
High-performance Electronic Components and Materials to Create Intelligent Society
Y. Shimada
20180 citations Open access
Semantic Scholar
High-performance Electronic Components and Materials for Supporting the Society in the 21st Century
Y. Shimada
20160 citations Open access
Semantic Scholar
Evolution and Future of Electronics Packaging Technology
Y. Shimada
20130 citations Open access
Semantic Scholar
New Development of High Performance Electoronic Components Materials Processing Technology
Y. Shimada
20120 citations Open access
Semantic Scholar
Change to the General Incorporated Association, and Activation of Institute
Y. Shimada
20120 citations Open access
Semantic Scholar
Toward the Innovation of the New Packaging Technology
Y. Shimada
20110 citations Open access
Semantic Scholar
High Performance Electronic Components, Materials and its Applicaions
Y. Shimada
20100 citations Open access
Semantic Scholar
Glass-ceramic packages
K. Ikuina, Y. Shimada, K. Utsumi
20050 citations
Semantic Scholar
Glass ‚Äì ceramic packages
K. Ikuina, Y. Shimada, K. Utsumi
20040 citations
Semantic Scholar
Electronic Packaging Technology Will Be Sources of High Additional Value
Y. Shimada
20010 citations
Semantic Scholar
Intention to Special Edition
Y. Shimada
19990 citations Open access
Semantic Scholar
New dimensions in memory
N. Takahashi, N. Senba, Y. Shimada, H. Morizaki +1 more
19970 citations
Semantic Scholar
Manufacturing method of a plastic-molded lead component
N. Takahashi, K. Soejima, N. Senba, Y. Shimada
19970 citations
Semantic Scholar
MCM Substrate Using Cu/Photosensitive-BCB Thin Film Multilayer Structure
K. Matsui, T. Shimoto, Y. Shimada
19970 citations
Semantic Scholar
Support element for cooler and electronic housing with such an element
Y. Shimada, T. Suyama, Yoshimasa Tanaka
19950 citations
Semantic Scholar
Hole grid array (HGA)-a new tape carrier package with high count I/O
S. Hasegawa, T. Suyama, Y. Shimada, K. Tamura +1 more
19951995 Proceedings. 45th Electronic Components and Technology Conference0 citations
Semantic Scholar
Glass ceramic multilayer substrate and process for its preparation
K. Ikuina, Y. Shimada
19930 citations
Semantic Scholar
A New Mask-less Printing Technology for Conductive Patterns on a Glass-Ceramic Green Sheet
Seiya Isozaki, Mitsuhiro Sugimoto, T. Ohshima, Y. Katoh +2 more
19920 citations Open access
Semantic Scholar
Low dielectric constant multilayer glass-ceramic substrate for VLSI package
Y. Shimada, Y. Yamashita, H. Takamizawa
19880 citations
Semantic Scholar

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K. Utsumi×13
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K. Utsumi — researcher profile on SciRah
H. Takamizawa×8
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H. Takamizawa — researcher profile on SciRah
T. Shimoto×7
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T. Shimoto — researcher profile on SciRah
K. Kata×6
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×6

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N. Takahashi — researcher profile on SciRah

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K. Matsui — researcher profile on SciRah

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K. Ikuina — researcher profile on SciRah

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N. Senba — researcher profile on SciRah

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Naoji Senba×3

Y. Yamashita×2

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Y. Yamashita — researcher profile on SciRah

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I. Morizaki — researcher profile on SciRah