Skip to content

Home Search Authors Pakistan News Saved

SciRah

SciRah does not host or store research papers. Results come live from free, official scholarly APIs, and every paper links back to its original source.

Data sources

OpenAlex
Semantic Scholar
Crossref
CORE
arXiv
PubMed

Privacy policy Terms of service

N. Hosoda · SciRah

Researcher profile · Semantic Scholar

N. Hosoda

Share profile

N. Hosoda — researcher profile on SciRah

h-index: 21
Works: 79
Citations: 1,790

Most-cited papers

Influence of surface roughness on gecko adhesion.
Gerrit Huber, S. Gorb, N. Hosoda, R. Spolenak +1 more
2007Acta Biomaterialia234 citations
Semantic Scholar
Effect of Surface Roughness on Room-Temperature Wafer Bonding by Ar Beam Surface Activation
H. Takagi, R. Maeda, T. Chung, N. Hosoda +1 more
1998175 citations Open access
Semantic Scholar
Influence of surface roughness on adhesion between elastic bodies.
A. Peressadko, N. Hosoda, B. Persson
2005Physical Review Letters126 citations Open access
Semantic Scholar
Room-temperature bonding of lithium niobate and silicon wafers by argon-beam surface activation
H. Takagi, R. Maeda, N. Hosoda, T. Suga
199999 citations
Semantic Scholar
Slippery pores: anti-adhesive effect of nanoporous substrates on the beetle attachment system
E. Gorb, N. Hosoda, C. Miksch, S. Gorb
2010Journal of the Royal Society Interface89 citations Open access
Semantic Scholar
Waterproof and translucent wings at the same time: problems and solutions in butterflies
P. Perez-Goodwyn, Y. Maezono, N. Hosoda, K. Fujisaki
2009Die Naturwissenschaften87 citations
Semantic Scholar
Transmission Electron Microscope Observations of Si/Si Interface Bonded at Room Temperature by Ar Beam Surface Activation
H. Takagi, R. Maeda, N. Hosoda, T. Suga
199986 citations
Semantic Scholar
Wafer direct bonding of compound semiconductors and silicon at room temperature by the surface activated bonding method
T. Chung, Liu Yang, N. Hosoda, H. Takagi +1 more
199778 citations
Semantic Scholar
Underwater locomotion in a terrestrial beetle: combination of surface de-wetting and capillary forces
N. Hosoda, S. Gorb
2012Proceedings of the Royal Society of London. Biological Sciences74 citations Open access
Semantic Scholar
Room temperature GaAsSi and InPSi wafer direct bonding by the surface activated bonding method
T. Chung, Liu Yang, N. Hosoda, T. Suga
199762 citations
Semantic Scholar
1.3 μm InGaAsP/InP lasers on GaAs substrate fabricated by the surface activated wafer bonding method at room temperature
T. Chung, N. Hosoda, T. Suga, H. Takagi
199857 citations
Semantic Scholar
Green Composite of Poly(3-hydroxybutyrate-co-3-hydroxyhexanoate) Reinforced with Porous Cellulose
N. Hosoda, T. Tsujimoto, H. Uyama
201454 citations
Semantic Scholar
Atomic structure of Al/Al interface formed by surface activated bonding
T. Akatsu, N. Hosoda, Tadatomo Suga, M. Rühle
199946 citations
Semantic Scholar
Hierarchical Structure of the Cocos nucifera (Coconut) Endocarp: Functional Morphology and its Influence on Fracture Toughness
Stefanie Schmier, N. Hosoda, T. Speck
2020Molecules42 citations Open access
Semantic Scholar
Friction force reduction triggers feet grooming behaviour in beetles
N. Hosoda, S. Gorb
2011Proceedings of the Royal Society of London. Biological Sciences42 citations Open access
Semantic Scholar
Active disassembly and reversible interconnection
Tadatomo Suga, N. Hosoda
2000Proceedings of the 2000 IEEE International Symposium on Electronics and the Environment (Cat. No.00CH37082)29 citations
Semantic Scholar
Fabrication of Porous Poly(3-hydroxybutyrate-co-3-hydroxyhexanoate) Monoliths via Thermally Induced Phase Separation
T. Tsujimoto, N. Hosoda, H. Uyama
2016Polymers24 citations Open access
Semantic Scholar
Effect of the surface treatment on the room-temperature bonding of Al to Si and SiO2
N. Hosoda, Y. Kyogoku, Tadatomo Suga
199823 citations
Semantic Scholar
Framework with cytoskeletal actin filaments forming insect footpad hairs inspires biomimetic adhesive device design
K. Kimura, Ryunosuke Minami, Y. Yamahama, T. Hariyama +1 more
2020Communications Biology22 citations Open access
Semantic Scholar
Strongest grip on the rod: tarsal morphology and attachment of Japanese pine sawyer beetles
D. Voigt, Takuma Takanashi, Kazuko Tsuchihara, K. Yazaki +3 more
2017Zoological Letters21 citations Open access
Semantic Scholar
Effects of O2 and H2O Preadsorptions on the H2 Absorption by La*
N. Hosoda, H. Uchida, Y. Ohtani, Tomoya Takahashi +1 more
198921 citations
Semantic Scholar
Reliability of Au bump-Cu direct interconnections fabricated by means of surface activated bonding method
Qian Wang, N. Hosoda, T. Itoh, T. Suga
2003Microelectronics and reliability20 citations
Semantic Scholar
Morphology and microstructure of the Ar+ion sputtered (0001)α-Al2O3 surface
T. Akatsu, C. Scheu, T. Wagner, T. Gemming +3 more
200020 citations
Semantic Scholar
Substrate-Borne Vibrations Induce Behavioral Responses in the Leaf-Dwelling Cerambycid, Paraglenea fortunei
R. Tsubaki, N. Hosoda, H. Kitajima, Takuma Takanashi
2014Zoological Science19 citations
Semantic Scholar
Room-temperature direct bonding of CMP-Cu film for bumpless interconnection
Akitsu Shigetou, N. Hosoda, Toshihiro Itoh, Tadatomo Suga
20012001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)19 citations
Semantic Scholar
Phase Separation-Induced Crystallization of Poly(3-hydroxybutyrate-co-hydroxyvalerate) by Branched Poly(lactic acid)
N. Hosoda, Eun-Hye Lee, T. Tsujimoto, H. Uyama
201318 citations
Semantic Scholar
C3F8 plasma fluorination of lead free solders for fluxless soldering
N. Hosoda, T. Suga
200418 citations
Semantic Scholar
Plant oil-based green composite using porous poly(3-hydroxybutyrate)
N. Hosoda, T. Tsujimoto, H. Uyama
201417 citations
Semantic Scholar
Microstructure and strength of Al-sapphire interface by means of the surface activated bonding method
T. Akatsu, G. Sasaki, N. Hosoda, Tadatomo Suga
199717 citations
Semantic Scholar
On the laboratory rearing of green dock leaf beetles Gastrophysa viridula (Coleoptera: Chrysomelidae)
D. Voigt, N. Hosoda, J. Schuppert, S. Gorb
201115 citations
Semantic Scholar
Room-Temperature Bonding of Si Wafers to Pt Films on SiO2 or LiNbO3 Substrates Using Ar-Beam Surface Activation
H. Takagi, R. Maeda, N. Hosoda, T. Suga
199913 citations Open access
Semantic Scholar
Evidence for intermolecular forces involved in ladybird beetle tarsal setae adhesion
N. Hosoda, Mari Nakamoto, T. Suga, S. Gorb
2021Scientific Reports12 citations Open access
Semantic Scholar
A New Approach To Cu-cu Direct Bump Bonding
Tadatomo Suga, Fumio Yuuki, N. Hosoda
1997IEMT/IMC Symposium, 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]12 citations
Semantic Scholar
Investigations on the Interface Microstructure of Stainless Steel/Aluminum Joints Created by the Surface Activated Bonding Method
Liu Yang, N. Hosoda, T. Suga
199712 citations
Semantic Scholar
Crucial role of framework with cytoskeletal actin filaments for shaping microstructure of footpad setae in the ladybird beetle, Harmonia axyridis.
K. Kimura, N. Hosoda
2020Arthropod structure & development11 citations
Semantic Scholar
A novel approach to assembly and interconnection for micro electro mechanical systems
T. Suga, N. Hosoda
1995Proceedings IEEE Micro Electro Mechanical Systems. 19959 citations
Semantic Scholar
TEM investigation of the stainless steel/aluminum interface created by the surface activated bonding method
Liu Yang, N. Hosoda, T. Suga
19978 citations
Semantic Scholar
Hydriding and dehydriding characteristics of LaNi5 mixed with silicone compounds
H. Uchida, T. Ebisawa, K. Terao, N. Hosoda +1 more
19878 citations
Semantic Scholar
Surface activated bonding between bulk single crystal diamond and bulk aluminum
M. Fujino, N. Hosoda, T. Suga, N. Ishikawa +1 more
20157 citations
Semantic Scholar
InGaAsP Lasers on GaAs Fabricated by the Surface Activated Wafer Direct Bonding Method at Room Temperature
T. Chung, N. Hosoda, T. Suga, H. Takagi
19987 citations Open access
Semantic Scholar
UHV-Bonding and Reversible Interconnection
N. Hosoda, T. Suga, S. Obara, K. Imagawa
20075 citations Open access
Semantic Scholar
Microassembly System for Integration of MEMS Using the Surface Activated Bonding Method
T. Suga, Y. Ishii, N. Hosoda
19975 citations
Semantic Scholar
A Novel Approach to Disassembly of Joined Interface
N. Hosoda, Tadatomo Suga
2005International Symposium on Environmentally Conscious Design and Inverse Manufacturing4 citations
Semantic Scholar
A Bonding Method Which is Designed for Separating at the Interface: Reversible Interconnection
N. Hosoda, Yang Liu, Y. Kyogoku, Tadatomo Suga
19964 citations Open access
Semantic Scholar
Low-temperature direct hybrid bonding of polypropylene to natural rubber and Cu by methyl glycine vapor-assisted vacuum ultraviolet (MG-VUV) method without vacuum
A. Shigetou, N. Hosoda
2022Materials letters (General ed.)3 citations Open access
Semantic Scholar
Smart disassembly [joint separation method]
N. Hosoda, Kohmei Halada, Tadatomo Suga
2004IEEE International Symposium on Electronics and the Environment, 2004. Conference Record. 20043 citations
Semantic Scholar
New Au-Al interconnect technology and its reliability by surface activated bonding
Zhonghua Xu, Tadatomo Suga, Toshihiro Itoh, N. Hosoda
2003Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003.2 citations
Semantic Scholar
Reversible interconnection by control of interface reactions
N. Hosoda, Tadatomo Suga
1999Proceedings First International Symposium on Environmentally Conscious Design and Inverse Manufacturing2 citations
Semantic Scholar
Reversible interconnection using hydrogen storage alloy
Fumiya Kitaoka, N. Hosoda, Tadatomo Suga
1999Proceedings First International Symposium on Environmentally Conscious Design and Inverse Manufacturing2 citations
Semantic Scholar
Eco-friendly Adhesion Technology Learning from Nature
N. Hosoda
20161 citations Open access
Semantic Scholar

Frequent co-authors

Invite them to SciRah by sharing their profile.

T. Suga×17
Invite
T. Suga — researcher profile on SciRah
Tadatomo Suga×12
Invite
Tadatomo Suga — researcher profile on SciRah
H. Takagi×6
Invite
H. Takagi — researcher profile on SciRah
S. Gorb×5
Invite
S. Gorb — researcher profile on SciRah

×4

Invite

R. Maeda — researcher profile on SciRah

Invite

T. Chung — researcher profile on SciRah

Invite

Liu Yang — researcher profile on SciRah

T. Tsujimoto×4

Invite

T. Tsujimoto — researcher profile on SciRah

Invite

H. Uyama — researcher profile on SciRah

Invite

T. Akatsu — researcher profile on SciRah

Invite

M. Rühle — researcher profile on SciRah

Invite

Y. Kyogoku — researcher profile on SciRah