S. Killge

Most-cited papers

1. In Situ Experiments To Reveal the Role of Surface Feature Sidewalls in the Cassie–Wenzel Transition

   R. Hensel, A. Finn, R. Helbig, S. Killge +2 more

   2014Langmuir43 citations Open access

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2. 3D system integration on 300 mm wafer level: High-aspect-ratio TSVs with ruthenium seed layer by thermal ALD and subsequent copper electroplating

   S. Killge, I. Bartusseck, Marcel Junige, Volker Neumann +6 more

   2019Microelectronic Engineering23 citations

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3. In situ studies on atomic layer etching of aluminum oxide using sequential reactions with trimethylaluminum and hydrogen fluoride

   J. Reif, Martin Knaut, S. Killge, M. Albert +2 more

   2022Journal of Vacuum Science & Technology A12 citations Open access

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4. Bioadhesion on Textured Interfaces in the Human Oral Cavity—An In Situ Study

   R. Helbig, M. Hannig, S. Basche, Janis Ortgies +3 more

   2022International Journal of Molecular Sciences9 citations Open access

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5. Design, Fabrication, and Comparison of 3D Multimode Optical Interconnects on Silicon Interposer

   Sujay Charania, Niels Neumann, S. Killge, Felix Winkler +6 more

   2020Journal of Lightwave Technology9 citations

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6. 3D Optical Coupling Techniques on Polymer Waveguides for Wafer and Board Level Integration

   Sebastian Lüngen, Sujay Charania, Tobias Tiedje, K. Nieweglowski +4 more

   2017Electronic Components and Technology Conference9 citations

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7. In vacuo studies on plasma-enhanced atomic layer deposition of cobalt thin films

   J. Reif, Martin Knaut, S. Killge, Felix Winkler +2 more

   2020Journal of Vacuum Science and Technology8 citations

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8. Optical Through-Silicon Vias

   S. Killge, Niels Neumann, D. Plettemeier, J. Bartha

   20167 citations

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9. Modeling and characterization of optical TSVs

   Niels Neumann, Sujay Charania, S. Killge, Z. Al-Husseini +4 more

   2017Other Conferences6 citations Open access

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10. Copper-Based TSV: Interposer

    S. Killge, Volker Neumann, J. Bartha

    20166 citations

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11. TSV Transistor—Vertical Metal Gate FET Inside a Through Silicon VIA

    Felix Winkler, S. Killge, D. Fischer, K. Richter +2 more

    2018IEEE Electron Device Letters5 citations

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12. Realization of optical multimode TSV waveguides for Si-Interposer in 3D-chip-stacks

    S. Killge, Sujay Charania, K. Richter, Niels Neumann +3 more

    2017Optics + Optoelectronics4 citations Open access

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13. Micro structured coupling elements for 3D silicon optical interposer

    Sujay Charania, Sebastian Lüngen, Z. Al-Husseini, S. Killge +5 more

    2017Optics + Optoelectronics4 citations Open access

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14. In vacuo investigations on the nucleation of TaCN by plasma enhanced atomic layer deposition

    J. Reif, Martin Knaut, S. Killge, M. Albert +1 more

    2019Microelectronic Engineering3 citations

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15. Introduction to Electrical 3D Integration

    S. Killge, Sujay Charania, J. Bartha

    20161 citations

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16. Chapter 2 Copper-Based TSV : Interposer

    S. Killge, Volker Neumann, J. Bartha

    20190 citations

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17. In-situ and in-vacuo studies on area selective atomic layer deposited ruthenium films on silicon and silicon oxide

    S. Killge, J. Reif, Martin Knaut, M. Albert +1 more

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