A. Phommahaxay

Most-cited papers

Scalable, sub 2μm pitch, Cu/SiCN to Cu/SiCN hybrid wafer-to-wafer bonding technology
E. Beyne, Soon-Wook Kim, Lan Peng, N. Heylen +8 more
2017International Electron Devices Meeting132 citations
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Influence of Composition of SiCN as Interfacial Layer on Plasma Activated Direct Bonding
Fumihiro Inoue, Lan Peng, S. Iacovo, A. Phommahaxay +7 more
2019ECS Journal of Solid State Science and Technology66 citations Open access
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2D materials: roadmap to CMOS integration
C. Huyghebaert, T. Schram, Q. Smets, T. Agarwal +18 more
2018International Electron Devices Meeting66 citations
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Integration of TSVs, wafer thinning and backside passivation on full 300mm CMOS wafers for 3D applications
A. Jourdain, T. Buisson, A. Phommahaxay, A. Redolfi +4 more
2011Electronic Components and Technology Conference51 citations
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Origin of Voids at the SiO2/SiO2 and SiCN/SiCN Bonding Interface Using Positron Annihilation Spectroscopy and Electron Spin Resonance
F. Nagano, Fumihiro Inoue, A. Phommahaxay, Lan Peng +7 more
2023ECS Journal of Solid State Science and Technology47 citations Open access
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Wafer-scale integration of double gated WS2-transistors in 300mm Si CMOS fab
I. Asselberghs, Q. Smets, T. Schram, B. Groven +20 more
2020International Electron Devices Meeting45 citations
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Void Formation Mechanism Related to Particles During Wafer-to-Wafer Direct Bonding
F. Nagano, S. Iacovo, A. Phommahaxay, Fumihiro Inoue +5 more
2022ECS Journal of Solid State Science and Technology36 citations Open access
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Influence of Si wafer thinning processes on (sub)surface defects
Fumihiro Inoue, A. Jourdain, Peng Lan, A. Phommahaxay +6 more
201736 citations
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Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding
A. Phommahaxay, A. Jourdain, G. Verbinnen, T. Woitke +12 more
2012IEEE International Conference on 3D System Integration31 citations
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Film Characterization of Low-Temperature Silicon Carbon Nitride for Direct Bonding Applications
F. Nagano, S. Iacovo, A. Phommahaxay, Fumihiro Inoue +4 more
2020ECS Journal of Solid State Science and Technology28 citations Open access
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Enabling Ultra-Thin Die to Wafer Hybrid Bonding for Future Heterogeneous Integrated Systems
A. Phommahaxay, S. Suhard, P. Bex, S. Iacovo +7 more
2019Electronic Components and Technology Conference28 citations
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A Novel Fan-Out Concept for Ultra-High Chip-to-Chip Interconnect Density with 20-µm Pitch
A. Podpod, J. Slabbekoorn, A. Phommahaxay, F. Duval +6 more
2018Electronic Components and Technology Conference28 citations
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Advances in SiCN-SiCN Bonding with High Accuracy Wafer-to-Wafer (W2W) Stacking Technology
Lan Peng, S.-W. Kim, S. Iacovo, Fumihiro Inoue +13 more
2018International Interconnect Technology Conference28 citations
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Direct Bonding Using Low Temperature SiCN Dielectrics
S. Iacovo, F. Nagano, V. Channam, E. Walsby +6 more
2022Electronic Components and Technology Conference27 citations
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High frequency scanning acoustic microscopy applied to 3D integrated process: Void detection in Through Silicon Vias
A. Phommahaxay, I. De Wolf, P. Hoffrogge, S. Brand +9 more
20132013 IEEE 63rd Electronic Components and Technology Conference24 citations
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A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer Warpage
S. Iacovo, K. D'Havé, O. O. Okudur, J. De Vos +11 more
2023Electronic Components and Technology Conference23 citations
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Integration and manufacturing aspects of moving from WaferBOND HT-10.10 to ZoneBOND material in temporary wafer bonding and debonding for 3D applications
A. Jourdain, A. Phommahaxay, G. Verbinnen, G. Murdoch +8 more
20132013 IEEE 63rd Electronic Components and Technology Conference22 citations
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Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding
S. Iacovo, Lan Peng, F. Nagano, T. Uhrmann +8 more
2021Electronic Components and Technology Conference20 citations
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10 and 7 μm Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process
J. Derakhshandeh, G. Capuz, V. Cherman, Fumihiro Inoue +14 more
2020Electronic Components and Technology Conference20 citations
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Morphological characterization and mechanical behavior by dicing and thinning on direct bonded Si wafer
Fumihiro Inoue, A. Podpod, Peng Lan, A. Phommahaxay +3 more
202019 citations
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The Growing Application Field of Laser Debonding: From Advanced Packaging to Future Nanoelectronics
A. Phommahaxay, G. Beyer, I. Radu, E. Beyne +16 more
20192019 International Wafer Level Packaging Conference (IWLPC)17 citations
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Advanced Dicing Technologies for Combination of Wafer to Wafer and Collective Die to Wafer Direct Bonding
Fumihiro Inoue, A. Phommahaxay, A. Podpod, S. Suhard +6 more
2019Electronic Components and Technology Conference17 citations
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Introduction of a New Carrier System for Collective Die-to-Wafer Hybrid Bonding and Laser-Assisted Die Transfer
K. Kennes, A. Phommahaxay, Alice Guerrero, O. Bauder +7 more
2020Electronic Components and Technology Conference16 citations
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Demonstration of a collective hybrid die-to-wafer integration using glass carrier
S. Suhard, K. Kennes, P. Bex, A. Jourdain +11 more
2021Electronic Components and Technology Conference15 citations
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The unique properties of SiCN as bonding material for hybrid bonding
S. Iacovo, Soon-Wook Kim, F. Nagano, Peng Lan +3 more
20212021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)15 citations
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Extremely Low-Force Debonding of Thinned CMOS Substrate by Laser Release of a Temporary Bonding Material
A. Phommahaxay, G. Potoms, G. Verbinnen, E. Sleeckx +11 more
2016Electronic Components and Technology Conference15 citations
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IR Laser Release for 3D Stacked Devices: Effect of the Release Stack Structure on the Debonding Mechanism
F. Chancerel, P. Urban, J. Slabbekoorn, Simon Halas +6 more
2024Electronic Components and Technology Conference14 citations
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Low temperature backside damascene processing on temporary carrier wafer targeting 7μm and 5μm pitch microbumps for N equal and greater than 2 die to wafer TCB stacking
J. Derakhshandeh, E. Beyne, G. Beyer, G. Capuz +13 more
2022Electronic Components and Technology Conference13 citations
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Importance of alignment control during permanent bonding and its impact on via-last alignment for high density 3D interconnects
J. De Vos, Lan Peng, A. Phommahaxay, Joost Van Ongeval +6 more
2016IEEE International Conference on 3D System Integration13 citations
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Integration of epitaxial monolayer MX₂ channels on 300mm wafers via Collective-Die-To-Wafer (CoD2W) transfer
Souvik Ghosh, Q. Smets, S. Banerjee, T. Schram +16 more
20232023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)12 citations
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Direct Bonding of low Temperature Heterogeneous Dielectrics
S. Iacovo, Lan Peng, A. Phommahaxay, Fumihiro Inoue +6 more
2019Electronic Components and Technology Conference12 citations
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Defect detection in Through Silicon Vias by GHz Scanning Acoustic Microscopy: Key ultrasonic characteristics
A. Phommahaxay, I. De Wolf, T. Djuric, P. Hoffrogge +6 more
2014Electronic Components and Technology Conference12 citations
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Carrier Systems for Collective Die-to-Wafer Bonding
K. Kennes, A. Phommahaxay, Alice Guerrero, S. Suhard +6 more
2022Electronic Components and Technology Conference11 citations
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Acoustic modulation during laser debonding of collective hybrid bonded dies
K. Kennes, A. Phommahaxay, Alice Guerrero, Dennis Bumueller +6 more
2021Electronic Components and Technology Conference11 citations
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Protective Layer for Collective Die to Wafer Hybrid Bonding
Fumihiro Inoue, J. Bertheau, S. Suhard, A. Phommahaxay +4 more
2019IEEE International Conference on 3D System Integration11 citations
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Edge trimming for surface activated dielectric bonded wafers
Fumihiro Inoue, A. Jourdain, Jakob Visker, Peng Lan +7 more
201711 citations
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Characterization of Silicon Carbon Nitride for Low Temperature Wafer-to-Wafer Direct Bonding
F. Nagano, S. Iacovo, A. Phommahaxay, Fumihiro Inoue +4 more
2020ECS Meeting Abstracts10 citations Open access
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TSV-assisted Hybrid FinFET CMOS - Silicon Photonics Technology for High Density Optical I/O
D. Guermandi, L. Bogaerts, M. Rakowski, Y. Ban +21 more
2019European Conference on Optical Communication10 citations
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Scaled transistors with 2D materials from the 300mm fab
I. Asselberghs, T. Schram, Q. Smets, B. Groven +14 more
2020IEEE Silicon Nanoelectronics Workshop8 citations
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Single-release-layer process for temporary bonding applications in the 3D integration area
A. Jourdain, A. Phommahaxay, D. Velenis, Alice Guerrero +7 more
2015Electronic Components and Technology Conference8 citations
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Integration of the ZoneBOND™ temporary bonding material in backside processing for 3D applications
A. Jourdain, A. Phommahaxay, G. Verbinnen, S. Suhard +5 more
20122012 4th Electronic System-Integration Technology Conference8 citations
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Advances in Temporary Carrier Technology for High-Density Fan-Out Device Build-up
A. Podpod, A. Phommahaxay, P. Bex, J. Slabbekoorn +9 more
2019Electronic Components and Technology Conference7 citations
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Study of wafer warpage for Fan-Out wafer level packaging: finite element modelling and experimental validation
Abdellah Salahouelhadj, M. B. González, K. Vanstreels, Arnita Podpod +3 more
2019International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems7 citations
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HIGH DENSITY AND HIGH BANDWIDTH CHIP-TO-CHIP CONNECTIONS WITH 20μm PITCH FLIP-CHIP ON FAN-OUT WAFER LEVEL PACKAGE
A. Podpod, D. Velenis, A. Phommahaxay, P. Bex +6 more
20182018 International Wafer Level Packaging Conference (IWLPC)7 citations
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Influence of Composition of SiCN Film for Surface Activated Bonding
Fumihiro Inoue, Lan Peng, S. Iacovo, A. Phommahaxay +7 more
2018ECS Transactions7 citations
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Characterization of inorganic dielectric layers for low thermal budget wafer-to-wafer bonding
Fumihiro Inoue, Peng Lan, A. Phommahaxay, Soon-Wook Kim +5 more
20172017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)7 citations
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Cost components for 3D system integration
D. Velenis, M. Detalle, S. Van Huylenbroeck, A. Jourdain +8 more
2014Electronics System-integration Technology Conference7 citations
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Process characterization of thin wafer debonding with thermoplastic materials
A. Phommahaxay, A. Jourdain, G. Verbinnen, T. Woitke +13 more
20122012 4th Electronic System-Integration Technology Conference7 citations
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Overlay Scaling Error Reduction for Hybrid Die-to-Wafer Bonding
P. Bex, Mario Gonzalez, S. Brems, A. Phommahaxay +13 more
2024Electronics System-integration Technology Conference6 citations
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Demonstration of a collective hybrid die-to-wafer integration
S. Suhard, A. Phommahaxay, K. Kennes, P. Bex +6 more
2020Electronic Components and Technology Conference6 citations
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