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R. I. Made · SciRah

Researcher profile · Semantic Scholar

R. I. Made

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R. I. Made — researcher profile on SciRah

h-index: 14
Works: 52
Citations: 638

Most-cited papers

Effect of Copper TSV Annealing on Via Protrusion for TSV Wafer Fabrication
A. Heryanto, W. N. Putra, A. Trigg, S. Gao +7 more
2012Journal of Electronic Materials156 citations
Semantic Scholar
Study of Low-Temperature Thermocompression Bonding in Ag-In Solder for Packaging Applications
R. I. Made, C. Gan, Liling Yan, Ai-Bin Yu +3 more
200957 citations
Semantic Scholar
Impact of deposition conditions on the crystallization kinetics of amorphous GeTe films
Chee-Ying Khoo, Hai Liu, W. Sasangka, R. I. Made +5 more
2015Journal of Materials Science43 citations Open access
Semantic Scholar
Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits
R. I. Made, C. Gan, Ling-Yan Li, K. Kor +3 more
201231 citations
Semantic Scholar
Role of two-dimensional electron gas (2DEG) in AlGaN/GaN high electron mobility transistor (HEMT) ON-state degradation
G. Syaranamual, W. Sasangka, R. I. Made, S. Arulkumaran +4 more
2016Microelectronics and reliability26 citations
Semantic Scholar
Health diagnosis and recuperation of aged Li-ion batteries with data analytics and equivalent circuit modeling
R. I. Made, Jing Lin, Jin-Tao Zhang, Yu Zhang +7 more
2023iScience23 citations Open access
Semantic Scholar
Noble metal alloy thin films by atomic layer deposition and rapid Joule heating
Yuan-Yuan Guo, Y. Zou, Chun-yu Cheng, Le-Yan Wang +5 more
2021Scientific Reports21 citations Open access
Semantic Scholar
Preventing phase separation in MOCVD-grown InAlAs compositionally graded buffer on silicon substrate using InGaAs interlayers
D. Kohen, X. Nguyen, R. I. Made, Christopher Heidelberger +3 more
201721 citations
Semantic Scholar
Artificial Intelligence and Generative Models for Materials Discovery -- A Review
A. Handoko, R. I. Made
202519 citations
Semantic Scholar
Closed‐Loop Multi‐Objective Optimization for Cu–Sb–S Photo‐Electrocatalytic Materials’ Discovery
Yang Bai, Zi Hui Jonathan Khoo, R. I. Made, Huiqing Xie +7 more
2023Advances in Materials19 citations
Semantic Scholar
Machine learning-assisted optimization of multi-metal hydroxide electrocatalysts for overall water splitting.
Carina Yi Jing Lim, R. I. Made, Zi Hui Jonathan Khoo, Chee-Ko-On Ng +5 more
2023Materials Horizons19 citations
Semantic Scholar
An Object-Oriented Framework to Enable Workflow Evolution Across Materials Acceleration Platforms
Chang Jie Leong, K. Low, Jose Recatala-Gomez, Pablo Quijano Velasco +11 more
2022Social Science Research Network19 citations
Semantic Scholar
Experimental characterization and modeling of the contact resistance of Cu–Cu bonded interconnects
H. L. Leong, C. Gan, R. I. Made, C. Thompson +2 more
200917 citations Open access
Semantic Scholar
Electrical behavior of Au-Ge eutectic solder under aging for solder bump application in high temperature Electronics
F. Lau, R. I. Made, Wahyuaji Narottama Putra, Jun Long Lim +3 more
2013Microelectronics and reliability14 citations
Semantic Scholar
Heteroepitaxial growth of In0.30Ga0.70As high-electron mobility transistor on 200 mm silicon substrate using metamorphic graded buffer
D. Kohen, X. Nguyen, S. Yadav, Annie Kumar +8 more
201611 citations Open access
Semantic Scholar
Composition driven machine learning for unearthing high-strength lightweight multi-principal element alloys
Mengxing Li, Xiu Kun Quek, H. Suo, Delvin Wuu +12 more
2024Journal of Alloys and Compounds10 citations
Semantic Scholar
Characterisation of defects generated during constant current InGaN-on-silicon LED operation
R. I. Made, Yu Gao, G. Syaranamual, W. Sasangka +6 more
2017Microelectronics and reliability10 citations Open access
Semantic Scholar
Threading dislocation movement in AlGaN/GaN-on-Si high electron mobility transistors under high temperature reverse bias stressing
W. Sasangka, G. Syaranamual, R. I. Made, C. Thompson +1 more
201610 citations Open access
Semantic Scholar
Pb-Free Glass Paste: A Metallization-Free Die-Attachment Solution for High-Temperature Application on Ceramic Substrates
A. Sharif, Jun Long Lim, R. I. Made, F. Lau +5 more
2013Journal of Electronic Materials10 citations
Semantic Scholar
Effect of direct current stressing to Cu-Cu bond interface imperfection for three dimensional integrated circuits
R. I. Made, Peng Lan, Hong-Yu Li, C. Gan +1 more
201310 citations Open access
Semantic Scholar
Improved reliability of AlGaN/GaN-on-Si high electron mobility transistors (HEMTs) with high density silicon nitride passivation
W. Sasangka, G. Syaranamual, Y. Gao, R. I. Made +2 more
2017Microelectronics and reliability9 citations Open access
Semantic Scholar
Germanium-on-insulator virtual substrate for InGaP epitaxy
Shuyu Bao, K. Lee, Cong Wang, Bing Wang +5 more
20178 citations
Semantic Scholar
Control wafer bow of InGaP on 200 mm Si by strain engineering
Bing Wang, Shuyu Bao, R. I. Made, K. Lee +4 more
20178 citations
Semantic Scholar
Characterization of copper conductive ink for low temperature sintering processing on flexible polymer substrate
Jaewon Kim, Byunghoon Lee, Yan-Lek Jun, R. I. Made +2 more
2014Electronic Packaging Technology Conference8 citations
Semantic Scholar
Direct bandgap photoluminescence from n-type indirect GaInP alloys
Cong Wang, Bing Wang, R. I. Made, S. Yoon +1 more
20177 citations
Semantic Scholar
Study of the evolution of Cu-Cu bonding interface imperfection under direct current stressing for three dimensional integrated circuits
R. I. Made, Peng Lan, Hong-Yu Li, C. Gan +1 more
20112011 IEEE International Interconnect Technology Conference7 citations Open access
Semantic Scholar
Fine-pitch bump-less Cu-Cu bonding for wafer-on-wafer stacking and its quality enhancement
Lan Peng, Hong-Yu Li, D. F. Lim, R. I. Made +3 more
2010IEEE International Conference on 3D System Integration7 citations
Semantic Scholar
Spatial variation of TSV capacitance and method of stabilization with Al2O3-induced negative fixed charge at the silicon-liner interface
L. Zhang, R. I. Made, Hong-Yu Li, S. Gao +3 more
2011International Electron Devices Meeting6 citations
Semantic Scholar
Study of Ag-In solder as low temperature wafer bonding intermediate layer
R. I. Made, C. Gan, Chengkuo Lee, Liling Yan +3 more
2008SPIE MOEMS-MEMS6 citations
Semantic Scholar
MOCVD Growth of High Quality InGaAs HEMT Layers on Large Scale Si Wafers for Heterogeneous Integration With Si CMOS
X. Nguyen, S. Yadav, K. Lee, D. Kohen +6 more
2017IEEE transactions on semiconductor manufacturing5 citations
Semantic Scholar
Direct MOCVD epitaxy of GaAsP on SiGe virtual substrate without growth of SiGe
Bing Wang, Cong Wang, D. Kohen, R. I. Made +6 more
20165 citations
Semantic Scholar
A Paradigm Shift: From Batch Processing to Flow Chemistry.
Kallum Hiten Mehta, R. I. Made, I. Parkin, Gopinathan Sankar +1 more
2025Small4 citations Open access
Semantic Scholar
Towards a greener electrosynthesis: pairing machine learning and 3D printing for rapid optimisation of anodic trifluoromethylation
Nipun Kumar Gupta, Yi-Lin Guo, Soon‐Yee Chang, Jing Lin +11 more
2024RSC Sustainability4 citations Open access
Semantic Scholar
Selective and Sustainable Oxidation of Allyl Alcohol in Water Using a TS-1 Catalyst in Continuous Flow: A Machine-Learning-Driven Approach
Kallum Hiten Mehta, R. I. Made, Stefanos Agrotis, I. Parkin +2 more
2025ACS Sustainable Chemistry & Engineering3 citations
Semantic Scholar
Improved mechanical and thermomechanical properties of alumina substrate via iron doping
R. I. Made, Eric Jian Rong Phua, S. Pramana, C. Wong +3 more
20132 citations Open access
Semantic Scholar
Novel encapsulation materials for High Pressure-High Temperature (HPHT) applications
Eric Jian Rong Phua, Ming Liu, R. I. Made, Li-Ying Zhang +5 more
20132 citations
Semantic Scholar
Growth of InGaAs-channel transistor layers on large-scale Si wafers for HeteroIntegration with Si CMOS
X. Nguyen, S. Yadav, K. Lee, D. Kohen +8 more
20171 citations
Semantic Scholar
The integration of InGaP LEDs with CMOS on 200 mm silicon wafers
Bing Wang, K. Lee, Cong Wang, Yue Wang +8 more
2017OPTO1 citations Open access
Semantic Scholar
Heteroepitaxial growth of In In[subscript 0.30]Ga[subscript 0.70]As high-electron mobility transistor on 200 mm silicon substrate using metamorphic graded buffer
D. Kohen, X. Nguyen, S. Yadav, Annie Kumar +8 more
20161 citations
Semantic Scholar
Modeling of Electromigration Induced Contact Resistance Reduction of Cu-Cu Bonded Interface
R. I. Made, C. Gan, Chuan-Seng Tan
2010ECS Transactions1 citations Open access
Semantic Scholar
Iron oxide crystallinity and distribution in Song dynasty northern black wares: Insights into ‘silvery’ and ‘golden’ oil spot glazes
Xuesong Yin, Wan-Wan Wang, R. I. Made, Tian Wang +5 more
2026Journal of Cultural Heritage0 citations Open access
Semantic Scholar
Direct Atmospheric Pressure Plasma Jet (APPJ) Synthesis of Nanosized CuO x -Ag Composites for Efficient Electrochemical CO 2 Reduction to Multi-Carbon Products
Stefanos Agrotis, Ming Lin, Kallum Hiten Mehta, O. Hagger +4 more
2026Journal of Materials Chemistry A0 citations Open access
Semantic Scholar
Anomalyspy: A Generative Defect Localization in Semiconductor Packages, with X-Ray Microscopy
R. I. Made, Pawan Kumar, Pablo Quijano Velasco, Chee-Ko-On Ng +1 more
2025Electronic Packaging Technology Conference0 citations
Semantic Scholar
mm silicon substrate using metamorphic graded buffer
D. Kohen, X. Nguyen, S. Yadav, Annie Kumar +9 more
20170 citations
Semantic Scholar
Exsolution lamellae in volcanic pyroxene; Single phenocryst thermometry for long-lived magmatic reservoir
R. I. Made, J. Herrin, Y.-Y. Tay, F. C. Rodríguez
20170 citations
Semantic Scholar
AlGaN/GaN高電子移動度トランジスタ(HEMT)オン状態分解における2次元電子ガス(2DEG)の役割【Powered by NICT】
G. Syaranamual, W. A. Sasangka, R. I. Made, S. Arulkumaran +4 more
20160 citations
Semantic Scholar
Lawrence Berkeley National Laboratory Recent Work Title Impact of deposition conditions on the crystallization kinetics of amorphous GeTe films Permalink
Chee-Ying Khoo, Hai Liu, W. Sasangka, R. I. Made +5 more
20150 citations
Semantic Scholar
Evaluation of Refractory Metals for Package Level Interconnection in a Harsh Environment
R. I. Made, Eric Jian Rong Phua, K. W. Tan, Chuan-Ong Wei +6 more
20130 citations
Semantic Scholar
Non-destructive mechanical characterization of metal to metal bond interface for 3D-ICs
R. I. Made, C. Gan
2011International Symposium on the Physical and Failure Analysis of Integrated Circuits0 citations
Semantic Scholar
Effect of Temperature and Bonding Duration on the Mechanical Strength of Metal to Metal Thermocompression Bonds
R. I. Made, C. Gan, Liling Yan
20080 citations
Semantic Scholar

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