Journal profile
IEEE Transactions on Components Packaging and Manufacturing Technology Part C
Published by Institute of Electrical and Electronics EngineersISSN 1083-4400, 1558-1241Since 1996United States
- Papers published
- 137
- Citations
- 2,595
- h-index
- 27
- 2-yr mean citations
- 0.00
- Open access
- 6%
Electronic Packaging and Soldering Technologies3D IC and TSV technologiesWelding Techniques and Residual StressesManufacturing Process and OptimizationIntegrated Circuits and Semiconductor Failure AnalysisSilicon Carbide Semiconductor TechnologiesElectrostatic Discharge in ElectronicsIndustrial Vision Systems and Defect Detection
Most cited